公开(公告)号：US11668655B2

公开(公告)日：2023-06-06

申请号：US16272528

申请日：2019-02-11

Applicant: KLA-Tencor Corporation

Inventor： Vaibhav Gaind ,  Grace H. Chen ,  Amrit Poudel ,  Mark S. Wang

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/8851 ,  G01N21/9501 ,  G01N2021/8874 ,  G01N2021/8887

Abstract: A semiconductor-inspection tool scans a semiconductor die using a plurality of optical modes. A plurality of defects on the semiconductor die are identified based on results of the scanning. Respective defects of the plurality of defects correspond to respective pixel sets of the semiconductor-inspection tool. The scanning fails to resolve the respective defects. The results include multi-dimensional data based on pixel intensity for the respective pixel sets, wherein each dimension of the multi-dimensional data corresponds to a distinct mode of the plurality of optical modes. A discriminant function is applied to the results to transform the multi-dimensional data for the respective pixel sets into respective scores. Based at least in part on the respective scores, the respective defects are divided into distinct classes.

公开(公告)号：US20180342051A1

公开(公告)日：2018-11-29

申请号：US15971536

申请日：2018-05-04

Applicant: KLA-TENCOR CORPORATION

Inventor： Abdurrahman Sezginer ,  Xiaochun Li ,  Pavan Kumar ,  Junqing Huang ,  Lisheng Gao ,  Grace H. Chen ,  Yalin Xiong ,  Hawren Fang

IPC: G06T7/00

Abstract: Systems and methods increase the signal to noise ratio of optical inspection of wafers to obtain higher inspection sensitivity. The computed reference image can minimize a norm of the difference of the test image and the computed reference image. A difference image between the test image and a computed reference image is determined. The computed reference image includes a linear combination of a second set of images.

公开(公告)号：US09816940B2

公开(公告)日：2017-11-14

申请号：US15001158

申请日：2016-01-19

Applicant: KLA-Tencor Corporation

Inventor： Grace H. Chen ,  Keith Buckley Wells ,  Markus B. Huber ,  Se Baek Oh

IPC: G01N21/00 ,  G01N21/88 ,  G01N21/95

CPC classification number: G01N21/8851 ,  G01N21/9501 ,  G01N2021/8887

Abstract: Disclosed are methods and apparatus for detecting defects in a semiconductor sample. An inspection tool is used to collect intensity data sets at a plurality of focus settings from each of a plurality of xy positions of the sample. A polynomial equation having a plurality of coefficients is extracted for each of the xy position's collected intensity data sets as a function of focus setting. Each of the coefficients' set of values for the plurality of xy positions is represented with a corresponding coefficient image plane. A target set of coefficient image planes and a reference set of coefficient image planes are then analyzed to detect defects on the sample.

公开(公告)号：US09523646B2

公开(公告)日：2016-12-20

申请号：US15158413

申请日：2016-05-18

Applicant: KLA-Tencor Corporation

Inventor： Grace H. Chen ,  Rudolf Brunner ,  Lisheng Gao ,  Robert M. Danen ,  Lu Chen

IPC: G01N21/00 ,  G01N21/88 ,  G01N21/95

CPC classification number: G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95623 ,  G01N2021/8822 ,  G01N2021/95676 ,  G01N2201/061 ,  G01N2201/0638 ,  G01N2201/068 ,  G01N2201/12

Abstract: In an optical inspection tool, an illumination aperture is opened at each of a plurality of aperture positions of an illumination pupil area one at a time across the illumination pupil area. For each aperture opening position, an incident beam is directed towards the illumination pupil area so as to selectively pass a corresponding ray bundle of the illumination beam at a corresponding set of one or more incident angles towards the sample and an output beam, which is emitted from the sample in response to the corresponding ray bundle of the incident beam impinging on the sample at the corresponding set of one or more incident angles, is detected. A defect detection characteristic for each aperture position is determined based on the output beam detected for each aperture position. An optimum aperture configuration is determined based on the determined defect detection characteristic for each aperture position.

公开(公告)号：US20140354983A1

公开(公告)日：2014-12-04

申请号：US14075488

申请日：2013-11-08

Applicant: KLA-Tencor Corporation

Inventor： Pavel Kolchin ,  Richard Wallingford ,  Lisheng Gao ,  Grace H. Chen ,  Markus b. Huber ,  Robert M. Danen

IPC: G01N21/88 ,  G01N21/95

CPC classification number: G01N21/9501

Abstract: Disclosed are methods and apparatus for optimizing a mode of an inspection tool. A first image or signal for each of a plurality of first apertures of the inspection tool is obtained, and each first image or signal pertains to a defect area. For each of a plurality of combinations of the first apertures and their first images or signals, a composite image or signal is obtained. Each composite image or signal is analyzed to determine an optimum one of the combinations of the first apertures based on a defect detection characteristic of each composite image.

Abstract translation: 公开了用于优化检查工具的模式的方法和装置。 获得检查工具的多个第一孔的每一个的第一图像或信号，并且每个第一图像或信号属于缺陷区域。 对于第一孔径及其第一图像或信号的多个组合中的每一个，获得合成图像或信号。 基于每个合成图像的缺陷检测特性，分析每个复合图像或信号以确定第一孔径的组合中的最佳一个。

公开(公告)号：US11270430B2

公开(公告)日：2022-03-08

申请号：US15971536

申请日：2018-05-04

Applicant: KLA-TENCOR CORPORATION

Inventor： Abdurrahman Sezginer ,  Xiaochun Li ,  Pavan Kumar ,  Junqing Huang ,  Lisheng Gao ,  Grace H. Chen ,  Yalin Xiong ,  Hawren Fang

IPC: G06T7/00

Abstract: Systems and methods increase the signal to noise ratio of optical inspection of wafers to obtain higher inspection sensitivity. The computed reference image can minimize a norm of the difference of the test image and the computed reference image. A difference image between the test image and a computed reference image is determined. The computed reference image includes a linear combination of a second set of images.

公开(公告)号：US10921262B2

公开(公告)日：2021-02-16

申请号：US16886255

申请日：2020-05-28

Applicant: KLA-Tencor Corporation

Inventor： Qiang Zhang ,  Grace H. Chen

IPC: G01N21/00 ,  G01N21/95 ,  G06T7/00 ,  G06T7/174 ,  G06T7/11 ,  G01N23/2251 ,  G01N21/956

Abstract: Disclosed are apparatus and methods for inspecting a sample. Locations corresponding to candidate defect events on a sample are provided from an inspector operable to acquire optical images from which such candidate defect events are detected at their corresponding locations across the sample. High-resolution images are acquired from a high-resolution inspector of the candidate defect events at their corresponding locations on the sample. Each of a set of modelled optical images, which have been modeled from a set of the acquired high-resolution images, is correlated with corresponding ones of a set of the acquired optical images, to identify surface noise events, as shown in the set of high-resolution images, as sources for the corresponding candidate events in the set of acquired optical images. Otherwise, a subsurface event is identified as a likely source for a corresponding candidate defect event.

公开(公告)号：US20150015874A1

公开(公告)日：2015-01-15

申请号：US14381315

申请日：2013-03-01

Applicant: KLA-Tencor Corporation

Inventor： Grace H. Chen ,  Rudolf Brunner ,  Lisheng Gao ,  Robert M. Danen ,  Lu Chen

IPC: G01N21/88

CPC classification number: G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/956 ,  G01N21/95623 ,  G01N2021/8822 ,  G01N2021/95676 ,  G01N2201/061 ,  G01N2201/0638 ,  G01N2201/068 ,  G01N2201/12

Abstract: In an optical inspection tool, an illumination aperture is opened at each of a plurality of aperture positions of an illumination pupil area one at a time across the illumination pupil area. For each aperture opening position, an incident beam is directed towards the illumination pupil area so as to selectively pass a corresponding ray bundle of the illumination beam at a corresponding set of one or more incident angles towards the sample and an output beam, which is emitted from the sample in response to the corresponding ray bundle of the incident beam impinging on the sample at the corresponding set of one or more incident angles, is detected. A defect detection characteristic for each aperture position is determined based on the output beam detected for each aperture position. An optimum aperture configuration is determined based on the determined defect detection characteristic for each aperture position.

Abstract translation: 在光学检查工具中，照明光圈在照明光瞳区域的多个孔径位置中的每一个处打开，一次一个地穿过照明瞳孔区域。 对于每个光圈打开位置，入射光束被引向照明光瞳区域，以便选择性地将照射光束的相应光束束以对应于一个或多个入射角的一组对应于样品的输出光束和输出光束 检测来自样品的响应于在相应的一个或多个入射角度的入射光束入射到样品上的相应射线束。 基于针对每个孔径位置检测的输出光束来确定每个光圈位置的缺陷检测特性。 基于针对每个孔位置确定的缺陷检测特性来确定最佳孔径配置。

公开(公告)号：US20200025689A1

公开(公告)日：2020-01-23

申请号：US16272528

申请日：2019-02-11

Applicant: KLA-Tencor Corporation

Inventor： Vaibhav Gaind ,  Grace H. Chen ,  Amrit Poudel ,  Mark S. Wang

IPC: G01N21/88 ,  G01N21/95

Abstract: A semiconductor-inspection tool scans a semiconductor die using a plurality of optical modes. A plurality of defects on the semiconductor die are identified based on results of the scanning. Respective defects of the plurality of defects correspond to respective pixel sets of the semiconductor-inspection tool. The scanning fails to resolve the respective defects. The results include multi-dimensional data based on pixel intensity for the respective pixel sets, wherein each dimension of the multi-dimensional data corresponds to a distinct mode of the plurality of optical modes. A discriminant function is applied to the results to transform the multi-dimensional data for the respective pixel sets into respective scores. Based at least in part on the respective scores, the respective defects are divided into distinct classes.

公开(公告)号：US10132760B2

公开(公告)日：2018-11-20

申请号：US15643333

申请日：2017-07-06

Applicant: KLA-Tencor Corporation

Inventor： Pavel Kolchin ,  Richard Wallingford ,  Lisheng Gao ,  Grace H. Chen ,  Markus B. Huber ,  Robert M. Danen

IPC: G01N21/95

Abstract: Disclosed are methods and apparatus for optimizing a mode of an inspection tool. A first image or signal for each of a plurality of first apertures of the inspection tool is obtained, and each first image or signal pertains to a defect area. For each of a plurality of combinations of the first apertures and their first images or signals, a composite image or signal is obtained. Each composite image or signal is analyzed to determine an optimum one of the combinations of the first apertures based on a defect detection characteristic of each composite image. In one aspect, determining an optimum one of the combinations of the first apertures includes selecting a set of one or more individual apertures that result in the highest signal to noise ratio for the defect area, and the method includes setting the optimum combination of the first apertures on the inspection tool and inspecting a sample using such optimum combination of the first apertures.