- 专利标题： Film for component manufacture and component manufacturing method
-
申请号： US16086706申请日： 2017-03-14
-
公开(公告)号： US11276600B2公开(公告)日： 2022-03-15
- 发明人: Eiji Hayashishita
- 申请人： MITSUI CHEMICALS TOHCELLO, INC.
- 申请人地址： JP Tokyo
- 专利权人： MITSUI CHEMICALS TOHCELLO, INC.
- 当前专利权人： MITSUI CHEMICALS TOHCELLO, INC.
- 当前专利权人地址： JP Tokyo
- 代理机构： Buchanan Ingersoll & Rooney PC
- 优先权： JPJP2016-072755 20160331
- 国际申请： PCT/JP2017/010253 WO 20170314
- 国际公布： WO2017/169747 WO 20171005
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; H01L21/683 ; C09J201/00 ; C09J7/20 ; C09J7/22 ; H01L21/67 ; H01L21/677 ; H01L21/02 ; B32B43/00 ; G01R1/04 ; G01R31/28
摘要：
Provided are a film for manufacturing semiconductor component, a film for electronic component manufacture, a method for manufacturing a semiconductor component using such a film for manufacturing semiconductor component, and a method for manufacturing an electronic component using such a film for electronic component manufacture. The film for component manufacture includes a base layer and an adhesive layer provided on one surface side of the base layer, and the Ra (μm) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 to 2.0, and the Rz (μm) is 1.0 to 15. The method using the film for component manufacture includes a segmenting step, a pickup step, and an evaluation step prior to the pickup step.
公开/授权文献
信息查询
IPC分类:
