Invention Grant
- Patent Title: Conductive lines with subtractive cuts
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Application No.: US16749476Application Date: 2020-01-22
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Publication No.: US11276639B2Publication Date: 2022-03-15
- Inventor: Brent Anderson , Lawrence A. Clevenger , Kisik Choi , Nicholas Anthony Lanzillo , Christopher J. Penny , Robert Robison
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Randall Bluestone
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L21/768 ; H01L21/311 ; H01L23/528
Abstract:
Integrated chips and methods of forming lines in the same include forming a line layer on a substrate. An opening is etched into the line layer that exposes the substrate. A plug is formed in the opening. The line layer is patterned to form a line that terminates at the plug.
Public/Granted literature
- US20210225761A1 CONDUCTIVE LINES WITH SUBTRACTIVE CUTS Public/Granted day:2021-07-22
Information query
IPC分类:
