Invention Grant
- Patent Title: Method of manufacturing an integrated component with improved spatial occupation, and integrated component
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Application No.: US16744865Application Date: 2020-01-16
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Publication No.: US11276789B2Publication Date: 2022-03-15
- Inventor: Luca Seghizzi , Linda Montagna , Giuseppe Visalli , Mikel Azpeitia Urquia
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: Crowe & Dunlevy
- Priority: IT102019000000917 20190122
- Main IPC: H01L31/0232
- IPC: H01L31/0232 ; H01L31/02 ; H01L31/0203 ; H01L31/113 ; H02N1/00 ; G02B26/08
Abstract:
A first wafer of semiconductor material has a surface. A second wafer of semiconductor material includes a substrate and a structural layer on the substrate. The structural layer integrates a detector device for detecting electromagnetic radiation. The structural layer of the second wafer is coupled to the surface of the first wafer. The substrate of the second wafer is shaped to form a stator, a rotor, and a mobile mass of a micromirror. The stator and the rotor form an assembly for capacitively driving the mobile mass.
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Information query
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