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公开(公告)号:US12113140B2
公开(公告)日:2024-10-08
申请号:US17668739
申请日:2022-02-10
Applicant: STMicroelectronics S.r.l.
Inventor: Luca Seghizzi , Linda Montagna , Giuseppe Visalli , Mikel Azpeitia Urquia
IPC: H01L31/0232 , G02B26/08 , H01L31/02 , H01L31/0203 , H01L31/113 , H02N1/00
CPC classification number: H01L31/02325 , G02B26/0841 , H01L31/02005 , H01L31/0203 , H01L31/1136 , H02N1/004
Abstract: Disclosed herein is an integrated component formed by a first wafer having first and second trenches defined in a top surface thereof, and a second wafer coupled to the first wafer and formed by a substrate with a structural layer thereon that integrated an electromagnetic radiation detector overlying the second trench. A first cap is coupled to the second wafer, overlies the electromagnetic radiation detector, and serves to define a first air-tight chamber in which the electromagnetic radiation detector is positioned. A stator, a rotor, and a mobile mass are integrated within the substrate and form a drive assembly for driving the mobile mass. The rotor overlies the first trench. A second cap is coupled to the second wafer, overlies the mobile mass, and serving to define a second air-tight chamber in which the mobile mass is positioned.
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公开(公告)号:US11276789B2
公开(公告)日:2022-03-15
申请号:US16744865
申请日:2020-01-16
Applicant: STMicroelectronics S.r.l.
Inventor: Luca Seghizzi , Linda Montagna , Giuseppe Visalli , Mikel Azpeitia Urquia
IPC: H01L31/0232 , H01L31/02 , H01L31/0203 , H01L31/113 , H02N1/00 , G02B26/08
Abstract: A first wafer of semiconductor material has a surface. A second wafer of semiconductor material includes a substrate and a structural layer on the substrate. The structural layer integrates a detector device for detecting electromagnetic radiation. The structural layer of the second wafer is coupled to the surface of the first wafer. The substrate of the second wafer is shaped to form a stator, a rotor, and a mobile mass of a micromirror. The stator and the rotor form an assembly for capacitively driving the mobile mass.
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