Invention Grant
- Patent Title: Device and method applicable for measuring ultrathin thickness of film on substrate
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Application No.: US16730236Application Date: 2019-12-30
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Publication No.: US11287253B2Publication Date: 2022-03-29
- Inventor: Chun-Ting Liu , Han-Yu Chang , Bo-Ching He , Guo-Dung Chen , Wen-Li Wu , Wei-En Fu
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: G01B15/02
- IPC: G01B15/02 ; G01N23/223 ; G01N23/2252

Abstract:
The present disclosure relates to a device and a method for measuring a thickness of an ultrathin film on a solid substrate. The thickness of the target ultrathin film is measured from the intensity of the fluorescence converted by the substrate and leaking and tunneling through the target ultrathin film at low detection angle. The fluorescence generated from the substrate has sufficient and stable high intensity, and therefore can provide fluorescence signal strong enough to make the measurement performed rapidly and precisely. The detection angle is small, and therefore the noise ratio is low, and efficiency of thickness measurement according to the method disclosed herein is high. The thickness measurement method can be applied into In-line product measurement without using standard sample, and therefore the thickness of the product can be measured rapidly and efficiently.
Public/Granted literature
- US20210199428A1 DEVICE AND METHOD APPLICABLE FOR MEASURING ULTRATHIN THICKNESS OF FILM ON SUBSTRATE Public/Granted day:2021-07-01
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