Invention Grant
- Patent Title: Plasma processing apparatus
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Application No.: US16123208Application Date: 2018-09-06
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Publication No.: US11289313B2Publication Date: 2022-03-29
- Inventor: Shota Umeda , Keita Nogi , Akira Kagoshima , Daisuke Shiraishi
- Applicant: HITACHI HIGH-TECH CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HITACHI HIGH-TECH CORPORATION
- Current Assignee: HITACHI HIGH-TECH CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge, P.C.
- Priority: JPJP2018-005761 20180117
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/67 ; G01J3/443 ; G05B19/418

Abstract:
Provided is a plasma processing apparatus including a processing unit in which a sample is plasma processed and which includes a monitor (optical emission spectroscopy) that monitors light emission of plasma, wherein the processing unit includes a prediction model storage unit that stores a prediction model predicting a plasma processing result, and a control device in which the plasma processing result is predicted by using a prediction model selected based on light emission data and device data as an indicator of state change of the processing unit.
Public/Granted literature
- US20190221407A1 PLASMA PROCESSING APPARATUS Public/Granted day:2019-07-18
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