公开(公告)号：US11289313B2

公开(公告)日：2022-03-29

申请号：US16123208

申请日：2018-09-06

Applicant: HITACHI HIGH-TECH CORPORATION

Inventor： Shota Umeda ,  Keita Nogi ,  Akira Kagoshima ,  Daisuke Shiraishi

IPC: H01J37/32 ,  H01L21/67 ,  G01J3/443 ,  G05B19/418

Abstract: Provided is a plasma processing apparatus including a processing unit in which a sample is plasma processed and which includes a monitor (optical emission spectroscopy) that monitors light emission of plasma, wherein the processing unit includes a prediction model storage unit that stores a prediction model predicting a plasma processing result, and a control device in which the plasma processing result is predicted by using a prediction model selected based on light emission data and device data as an indicator of state change of the processing unit.

公开(公告)号：US20220157580A1

公开(公告)日：2022-05-19

申请号：US16971255

申请日：2019-07-30

Applicant: Hitachi High-Tech Corporation

Inventor： Shota Umeda ,  Kenji Tamaki ,  Masahiro Sumiya ,  Masaki Ishiguro

IPC: H01J37/32 ,  G06N7/00 ,  G01M99/00

Abstract: In a diagnosis apparatus for diagnosing a state of a plasma processing apparatus, prior distribution information including a probability distribution function is previously obtained for each of first sensors by using first sensor values obtained by the first sensors in a first plasma processing apparatus, a probability distribution in each of second sensors corresponding to each of the first sensors is estimated based on the previously obtained prior distribution information and second sensor values obtained by the second sensors in a second plasma processing apparatus different from the first plasma processing apparatus, and a state of the second plasma processing apparatus is diagnosed by using the estimated probability distribution.

公开(公告)号：US12040167B2

公开(公告)日：2024-07-16

申请号：US16971255

申请日：2019-07-30

Applicant: Hitachi High-Tech Corporation

Inventor： Shota Umeda ,  Kenji Tamaki ,  Masahiro Sumiya ,  Masaki Ishiguro

IPC: H01J37/32 ,  G01M99/00 ,  G06N7/01

CPC classification number: H01J37/32917 ,  G01M99/005 ,  G06N7/01 ,  H01J2237/24578

Abstract: In a diagnosis apparatus for diagnosing a state of a plasma processing apparatus, prior distribution information including a probability distribution function is previously obtained for each of first sensors by using first sensor values obtained by the first sensors in a first plasma processing apparatus, a probability distribution in each of second sensors corresponding to each of the first sensors is estimated based on the previously obtained prior distribution information and second sensor values obtained by the second sensors in a second plasma processing apparatus different from the first plasma processing apparatus, and a state of the second plasma processing apparatus is diagnosed by using the estimated probability distribution.

公开(公告)号：US20220399182A1

公开(公告)日：2022-12-15

申请号：US17431516

申请日：2020-06-15

Applicant: Hitachi High-Tech Corporation

Inventor： Shota Umeda ,  Masahiro Sumiya ,  Yoshito Kamaji ,  Kenji Tamaki

IPC: H01J37/32

Abstract: In a plasma processing apparatus, occurrence of unplanned maintenance is predicted in advance so that a time when the work should be incorporated into planned maintenance can be determined. An apparatus diagnostic apparatus including a degradation score estimation unit that receives an output of a sensor mounted on a plasma processing apparatus and estimates a degradation score of the plasma processing device; a maintenance work occurrence probability estimation unit that calculates a probability of occurrence of an unplanned maintenance work that is not included in an original maintenance plan based on the degradation score; an actual maintenance cost calculation unit that calculates an actual maintenance cost; and a plan incorporated maintenance cost calculation unit that outputs a correction plan of maintenance plan in which the original maintenance plan is corrected by incorporating the unplanned maintenance work based on the probability of occurrence of the unplanned maintenance work.

公开(公告)号：US20210074528A1

公开(公告)日：2021-03-11

申请号：US16950179

申请日：2020-11-17

Applicant: Hitachi High-Tech Corporation

Inventor： Ryoji Asakura ,  Shota Umeda ,  Daisuke Shiraishi ,  Akira Kagoshima ,  Satomi Inoue

IPC: H01J37/32 ,  H01L21/67 ,  G01J3/443

Abstract: The plasma processing apparatus includes a plasma processing unit that performs plasma processing of a sample and a control unit that controls the plasma processing. The control unit selects one of a plurality of the prediction models for predicting a result of the plasma processing based on a state of the plasma processing unit, and predicts the result of the plasma processing by using a selected prediction model.

公开(公告)号：US12014909B2

公开(公告)日：2024-06-18

申请号：US16950179

申请日：2020-11-17

Applicant: Hitachi High-Tech Corporation

Inventor： Ryoji Asakura ,  Shota Umeda ,  Daisuke Shiraishi ,  Akira Kagoshima ,  Satomi Inoue

IPC: H01J37/32 ,  G01J3/443 ,  H01L21/67

CPC classification number: H01J37/32926 ,  G01J3/443 ,  H01L21/67069 ,  H01L21/67253 ,  H01J2237/334

Abstract: The plasma processing apparatus includes a plasma processing unit that performs plasma processing of a sample and a control unit that controls the plasma processing. The control unit selects one of a plurality of the prediction models for predicting a result of the plasma processing based on a state of the plasma processing unit, and predicts the result of the plasma processing by using a selected prediction model.