Invention Grant
- Patent Title: Grounding mechanism for multi-layer for electrostatic chuck, and related methods
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Application No.: US16938547Application Date: 2020-07-24
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Publication No.: US11309207B2Publication Date: 2022-04-19
- Inventor: Steven Donnell , Jakub Rybczynski , Chun Wang Chan , Yan Liu
- Applicant: ENTEGRIS, INC.
- Applicant Address: US MA Billerica
- Assignee: ENTEGRIS, INC.
- Current Assignee: ENTEGRIS, INC.
- Current Assignee Address: US MA Billerica
- Agency: Entegris, Inc.
- Main IPC: H01T23/00
- IPC: H01T23/00 ; H01L21/683
Abstract:
Described are multi-layer electrostatic chucks used to secure and support a wafer substrate during wafer processing, and related methods, wherein the chuck includes a grounding structure that includes a grounding layer and a grounding pin.
Public/Granted literature
- US20210028046A1 GROUNDING MECHANISM FOR MULTI-LAYER FOR ELECTROSTATIC CHUCK, AND RELATED METHODS Public/Granted day:2021-01-28
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