公开(公告)号：US20230337407A1

公开(公告)日：2023-10-19

申请号：US18131208

申请日：2023-04-05

Applicant: ENTEGRIS, INC.

Inventor： Yuxuan Liu ,  Zhifeng Li ,  Carlo Waldfried ,  Yan Liu ,  Chandra Venkatraman ,  Pushkara Rao Varanasi

IPC: H05K9/00 ,  H01L21/683

CPC classification number: H05K9/0079 ,  H01L21/6833

Abstract: A conductive polymeric layer on an electrostatic chuck. The conductive polymeric layer comprises a conductive polymer and a photosensitive polymer. The conductivity of the conductive polymer promotes charge dissipation by the conductive polymeric layer, while the photosensitivity of the photosensitive polymer allows the surface of the conductive polymeric layer to be photopatterned. The extent to which the conductive polymeric layer is conductive and photosensitive may be modulated by varying the relative amounts of the conductive polymer and the photosensitive polymer.

公开(公告)号：US20230136703A1

公开(公告)日：2023-05-04

申请号：US17974019

申请日：2022-10-26

Applicant: ENTEGRIS, INC.

Inventor： Yan Liu ,  Jakub Rybczynski ,  Caleb Minsky ,  Steven Donnell

IPC: H01L21/683 ,  C23C16/40 ,  C23C16/455

Abstract: Described are electrostatic chuck devices that are useful to support a workpiece while processing the workpiece, upper ceramic layer components of electrostatic chuck assemblies, the upper ceramic layer having a deposited dielectric layer, a relatively smooth finish, or both, and related methods.

公开(公告)号：US11612972B2

公开(公告)日：2023-03-28

申请号：US17459272

申请日：2021-08-27

Applicant: ENTEGRIS, INC.

Inventor： Yan Liu ,  Steven Donnell ,  Jakub Rybczynski ,  Chun Wang Chan ,  Caleb Minsky

IPC: H01T23/00 ,  B23Q3/15 ,  H01L21/683 ,  B23K1/19 ,  H01L21/687 ,  B23K1/00 ,  B23K103/00

Abstract: Described are electrostatic chucks that are useful to support a workpiece during a step of processing the workpiece, the electrostatic chuck including embossments that are made of multiple deposited layers, the layers including diamond-like carbon layers and layers that contain silicon-based materials such as silicon carbide layers.

公开(公告)号：US11772127B2

公开(公告)日：2023-10-03

申请号：US17867530

申请日：2022-07-18

Applicant: ENTEGRIS, INC.

Inventor： Yan Liu ,  Yuxuan Liu ,  Chandra Venkatraman ,  Carlo Waldfried

IPC: B05D3/06 ,  B05D1/02 ,  B05D3/02 ,  H01L21/683

CPC classification number: B05D3/06 ,  B05D1/02 ,  B05D3/0254 ,  H01L21/6833

Abstract: Described are techniques for applying a cured polymeric blanket coating onto a surface, specifically for applying a blanket-coated cured polymeric coating onto a surface of a substrate that is useful as an electrostatic chuck for processing semiconductor wafers.

公开(公告)号：US12101920B2

公开(公告)日：2024-09-24

申请号：US18131208

申请日：2023-04-05

Applicant: ENTEGRIS, INC.

Inventor： Yuxuan Liu ,  Zhifeng Li ,  Carlo Waldfried ,  Yan Liu ,  Chandra Venkatraman ,  Pushkara Rao Varanasi

IPC: H05K9/00 ,  H01B1/00 ,  H01B1/12 ,  H01L21/683

CPC classification number: H05K9/0079 ,  H01B1/124 ,  H01L21/6833

Abstract: A conductive polymeric layer on an electrostatic chuck. The conductive polymeric layer comprises a conductive polymer and a photosensitive polymer. The conductivity of the conductive polymer promotes charge dissipation by the conductive polymeric layer, while the photosensitivity of the photosensitive polymer allows the surface of the conductive polymeric layer to be photopatterned. The extent to which the conductive polymeric layer is conductive and photosensitive may be modulated by varying the relative amounts of the conductive polymer and the photosensitive polymer.

公开(公告)号：US20230274967A1

公开(公告)日：2023-08-31

申请号：US18113941

申请日：2023-02-24

Applicant: ENTEGRIS, INC.

Inventor： Jakub Rybczynski ,  Steven Donnell ,  Yan Liu ,  Caleb Minsky ,  Chandra Venkatraman ,  Carlo Waldfried

IPC: H01L21/683

CPC classification number: H01L21/6833

Abstract: Described are electrostatic chucks that are useful to support a workpiece during a step of processing the workpiece, the electrostatic chuck including a pattern of charge dissipation lines on an insulating layer, the lines having a first conductive layer and a second conductive layer and being arranged to define enclosed fields of the insulating layer between the lines.

公开(公告)号：US11837492B2

公开(公告)日：2023-12-05

申请号：US17317585

申请日：2021-05-11

Applicant: ENTEGRIS, INC.

Inventor： Yan Liu ,  Jakub Rybczynski ,  Steven Donnell ,  Caleb Minsky ,  Chun Wang Chan

IPC: H01T23/00 ,  H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67017 ,  H01L21/67109 ,  H01L21/67248

Abstract: Described are electrostatic chucks designed for use in supporting a workpiece during a workpiece processing step, the electrostatic chuck including a gas flow system.

公开(公告)号：US11417557B2

公开(公告)日：2022-08-16

申请号：US17122959

申请日：2020-12-15

Applicant: ENTEGRIS, INC.

Inventor： Chun Wang Chan ,  Jakub Rybczynski ,  Yan Liu

IPC: H01T23/00 ,  H01L21/683

Abstract: Electrostatic chucks include multiple electrodes, each having a spiral shape surrounding a center of a surface of the electrostatic chuck, to provide a polyphase electrostatic chuck. Each electrode can be connected to a different phase of power. The spiral shapes can each avoid one another as well as avoiding holes or openings in the surface of the electrostatic chuck. The spiral shapes can be algorithmically determined using a processor. These electrostatic chucks can include three or more electrodes. Methods of manufacture of the electrostatic chucks include determining shapes for each of the electrodes and providing each of the electrodes.

公开(公告)号：US11309207B2

公开(公告)日：2022-04-19

申请号：US16938547

申请日：2020-07-24

Applicant: ENTEGRIS, INC.

Inventor： Steven Donnell ,  Jakub Rybczynski ,  Chun Wang Chan ,  Yan Liu

IPC: H01T23/00 ,  H01L21/683

Abstract: Described are multi-layer electrostatic chucks used to secure and support a wafer substrate during wafer processing, and related methods, wherein the chuck includes a grounding structure that includes a grounding layer and a grounding pin.

公开(公告)号：US11742781B2

公开(公告)日：2023-08-29

申请号：US16682497

申请日：2019-11-13

Applicant: ENTEGRIS, INC.

Inventor： Yan Liu ,  Jakub Rybczynski ,  Steven Donnell ,  Chun Wang Chan

IPC: H02N13/00 ,  H01L21/683 ,  B23Q3/152

CPC classification number: H02N13/00 ,  B23Q3/152 ,  H01L21/6831 ,  H01L21/6833

Abstract: An electrostatic chuck solves the problem of wafer sticking by providing conductive paths on raised embossments that are bridged together and are connected to ground that support the wafer substrate above the surface of the electrostatic chuck. Further, laterally spaced electrode patterns and electrode elements which are spaced laterally and longitudinally away from the raised embossments reduce or eliminate electrical coupling during wafer clamping between conductively coated embossments and the electrode elements, thereby creating a low resistance path for charges remaining on the wafer after declamping to promptly travel to ground. The conductive bridge and electrode pattern configuration also substantially reduces or eliminates any charge build up on the conductive bridge(s) during clamping in order that charge build up in “islands” (worn portions of the insulator layer of the main field area) do not affect the charge dissipation from the wafer substrate through the conductive bridges to ground.