公开(公告)号：US11612972B2

公开(公告)日：2023-03-28

申请号：US17459272

申请日：2021-08-27

Applicant: ENTEGRIS, INC.

Inventor： Yan Liu ,  Steven Donnell ,  Jakub Rybczynski ,  Chun Wang Chan ,  Caleb Minsky

IPC: H01T23/00 ,  B23Q3/15 ,  H01L21/683 ,  B23K1/19 ,  H01L21/687 ,  B23K1/00 ,  B23K103/00

Abstract: Described are electrostatic chucks that are useful to support a workpiece during a step of processing the workpiece, the electrostatic chuck including embossments that are made of multiple deposited layers, the layers including diamond-like carbon layers and layers that contain silicon-based materials such as silicon carbide layers.

公开(公告)号：US11742781B2

公开(公告)日：2023-08-29

申请号：US16682497

申请日：2019-11-13

Applicant: ENTEGRIS, INC.

Inventor： Yan Liu ,  Jakub Rybczynski ,  Steven Donnell ,  Chun Wang Chan

IPC: H02N13/00 ,  H01L21/683 ,  B23Q3/152

CPC classification number: H02N13/00 ,  B23Q3/152 ,  H01L21/6831 ,  H01L21/6833

Abstract: An electrostatic chuck solves the problem of wafer sticking by providing conductive paths on raised embossments that are bridged together and are connected to ground that support the wafer substrate above the surface of the electrostatic chuck. Further, laterally spaced electrode patterns and electrode elements which are spaced laterally and longitudinally away from the raised embossments reduce or eliminate electrical coupling during wafer clamping between conductively coated embossments and the electrode elements, thereby creating a low resistance path for charges remaining on the wafer after declamping to promptly travel to ground. The conductive bridge and electrode pattern configuration also substantially reduces or eliminates any charge build up on the conductive bridge(s) during clamping in order that charge build up in “islands” (worn portions of the insulator layer of the main field area) do not affect the charge dissipation from the wafer substrate through the conductive bridges to ground.

公开(公告)号：US11837492B2

公开(公告)日：2023-12-05

申请号：US17317585

申请日：2021-05-11

Applicant: ENTEGRIS, INC.

Inventor： Yan Liu ,  Jakub Rybczynski ,  Steven Donnell ,  Caleb Minsky ,  Chun Wang Chan

IPC: H01T23/00 ,  H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67017 ,  H01L21/67109 ,  H01L21/67248

Abstract: Described are electrostatic chucks designed for use in supporting a workpiece during a workpiece processing step, the electrostatic chuck including a gas flow system.

公开(公告)号：US11417557B2

公开(公告)日：2022-08-16

申请号：US17122959

申请日：2020-12-15

Applicant: ENTEGRIS, INC.

Inventor： Chun Wang Chan ,  Jakub Rybczynski ,  Yan Liu

IPC: H01T23/00 ,  H01L21/683

Abstract: Electrostatic chucks include multiple electrodes, each having a spiral shape surrounding a center of a surface of the electrostatic chuck, to provide a polyphase electrostatic chuck. Each electrode can be connected to a different phase of power. The spiral shapes can each avoid one another as well as avoiding holes or openings in the surface of the electrostatic chuck. The spiral shapes can be algorithmically determined using a processor. These electrostatic chucks can include three or more electrodes. Methods of manufacture of the electrostatic chucks include determining shapes for each of the electrodes and providing each of the electrodes.

公开(公告)号：US11309207B2

公开(公告)日：2022-04-19

申请号：US16938547

申请日：2020-07-24

Applicant: ENTEGRIS, INC.

Inventor： Steven Donnell ,  Jakub Rybczynski ,  Chun Wang Chan ,  Yan Liu

IPC: H01T23/00 ,  H01L21/683

Abstract: Described are multi-layer electrostatic chucks used to secure and support a wafer substrate during wafer processing, and related methods, wherein the chuck includes a grounding structure that includes a grounding layer and a grounding pin.