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    Electrostatic chuck with charge dissipation coating
    1.
    发明授权
    Electrostatic chuck with charge dissipation coating 有权

    公开(公告)号：US11742781B2

    公开(公告)日：2023-08-29

    申请号：US16682497

    申请日：2019-11-13

    Applicant: ENTEGRIS, INC.

    Inventor： Yan Liu ,  Jakub Rybczynski ,  Steven Donnell ,  Chun Wang Chan

    IPC: H02N13/00 ,  H01L21/683 ,  B23Q3/152

    CPC classification number: H02N13/00 ,  B23Q3/152 ,  H01L21/6831 ,  H01L21/6833

    Abstract: An electrostatic chuck solves the problem of wafer sticking by providing conductive paths on raised embossments that are bridged together and are connected to ground that support the wafer substrate above the surface of the electrostatic chuck. Further, laterally spaced electrode patterns and electrode elements which are spaced laterally and longitudinally away from the raised embossments reduce or eliminate electrical coupling during wafer clamping between conductively coated embossments and the electrode elements, thereby creating a low resistance path for charges remaining on the wafer after declamping to promptly travel to ground. The conductive bridge and electrode pattern configuration also substantially reduces or eliminates any charge build up on the conductive bridge(s) during clamping in order that charge build up in “islands” (worn portions of the insulator layer of the main field area) do not affect the charge dissipation from the wafer substrate through the conductive bridges to ground.

    Electrostatic Chuck With Photo-Patternable Soft Protrusion Contact Surface
    2.
    发明申请
    Electrostatic Chuck With Photo-Patternable Soft Protrusion Contact Surface 有权
    静电卡盘带有可图形化软突起接触面

    公开(公告)号：US20150294891A1

    公开(公告)日：2015-10-15

    申请号：US14439464

    申请日：2013-10-29

    Applicant: ENTEGRIS, INC.

    Inventor： I-Kuan Lin ,  Richard A. Cooke ,  Jakub Rybczynski

    IPC: H01L21/683

    CPC classification number: H01L21/6831 ,  C23C16/4581 ,  H01L21/6875 ,  H01L21/68757 ,  H02N13/00

    Abstract: In accordance with an embodiment of the invention, there is provided a soft protrusion structure for an electrostatic chuck, which offers a non-abrasive contact surface for wafers, workpieces or other substrates, while also having improved manufacturability and compatibility with grounded surface platen designs. The soft protrusion structure comprises a photo-patternable polymer.

    Abstract translation: 根据本发明的实施例，提供了一种用于静电卡盘的软突起结构，其提供用于晶片，工件或其它基板的非研磨接触表面，同时具有改进的可制造性和与接地的平台台板设计的兼容性。 软突起结构包括可光致图案的聚合物。

    LASER ABLATION APPLICATIONS FOR ELECTROSTATIC CHUCKS
    5.
    发明申请
    LASER ABLATION APPLICATIONS FOR ELECTROSTATIC CHUCKS 有权

    公开(公告)号：US20250144746A1

    公开(公告)日：2025-05-08

    申请号：US18900625

    申请日：2024-09-27

    Applicant: ENTEGRIS, INC.

    Inventor： Doruk Yener ,  Jakub Rybczynski ,  Isaac J. Parker ,  Nilesh Gunda ,  Christopher J. Yannetta ,  Supil Raina ,  Chandrasekaran Venkatraman

    IPC: B23K26/40 ,  B23K101/36

    Abstract: Electrostatic chucks and methods for forming electrostatic chucks are provided. A method comprises obtaining a substrate comprising an etch resistant coating layer; ablating, with a laser, the etch resistant coating layer so as to remove at least a portion of the etch resistant coating layer so as to provide one or more exposed portions of the substrate; and forming an electrostatic chuck, wherein, when measuring an electrical resistance across the one or more exposed portions of the substrate between two metallized portions, the electrostatic chuck exhibits an electrical isolation of 300 GΩ or more. An electrostatic chuck comprises a substrate having at least one etch resistant coating layer comprising a laser ablated pattern, wherein the laser ablated pattern comprises one or more exposed portions of the substrate spanning distances of at least 0.5 mm.

    Spiraling polyphase electrodes for electrostatic chuck
    7.
    发明授权
    Spiraling polyphase electrodes for electrostatic chuck 有权

    公开(公告)号：US11417557B2

    公开(公告)日：2022-08-16

    申请号：US17122959

    申请日：2020-12-15

    Applicant: ENTEGRIS, INC.

    Inventor： Chun Wang Chan ,  Jakub Rybczynski ,  Yan Liu

    IPC: H01T23/00 ,  H01L21/683

    Abstract: Electrostatic chucks include multiple electrodes, each having a spiral shape surrounding a center of a surface of the electrostatic chuck, to provide a polyphase electrostatic chuck. Each electrode can be connected to a different phase of power. The spiral shapes can each avoid one another as well as avoiding holes or openings in the surface of the electrostatic chuck. The spiral shapes can be algorithmically determined using a processor. These electrostatic chucks can include three or more electrodes. Methods of manufacture of the electrostatic chucks include determining shapes for each of the electrodes and providing each of the electrodes.

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