Invention Grant
- Patent Title: Fluid property sensor
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Application No.: US16605088Application Date: 2017-10-18
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Publication No.: US11318750B2Publication Date: 2022-05-03
- Inventor: Chien-Hua Chen , Michael W Cumbie , Anthony D. Studer
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: Trop Pruner & Hu PC
- International Application: PCT/US2017/057097 WO 20171018
- International Announcement: WO2019/078835 WO 20190425
- Main IPC: B41J2/175
- IPC: B41J2/175

Abstract:
In one example, a fluid property sensor includes an electrical circuit assembly (ECA), an elongated circuit (EC), and an external interface. The EC is attached to the ECA and includes multiple point sensors distributed along a length of the EC. The external interface is electrically coupled to a proximal end of the EC. The EC and the external interface are packaged together with an encasement on both sides of the ECA to form the fluid property sensor.
Public/Granted literature
- US20210129550A1 FLUID PROPERTY SENSOR Public/Granted day:2021-05-06
Information query
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