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    PRINTABLE LIQUID SUPPLY CARTRIDGES
    1.
    发明公开
    PRINTABLE LIQUID SUPPLY CARTRIDGES 审中-公开

    公开(公告)号：US20230166518A1

    公开(公告)日：2023-06-01

    申请号：US18096555

    申请日：2023-01-12

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Anthony D. Studer ,  David Olsen

    IPC: B41J2/175

    CPC classification number: B41J2/1753 ,  B41J2/17546

    Abstract: A printable liquid supply cartridge includes a printable liquid reservoir extending between a first side and a second side, and between a front end and a rear end. The front end includes a printable liquid outlet to receive a first fluid pen and a gas inlet, above the printable liquid outlet, to receive a second fluid pen. The front end also includes an interface support at the first side, the support having an I2C data interface that includes electrical connection pads exposed on an interior side of the support to face from the first side towards the second side, the electrical connection pads being arranged vertically and to make contact with the printer data interface at least partially inserted into the second portion.

    Fluid property sensor
    3.
    发明授权
    Fluid property sensor 有权

    公开(公告)号：US11318750B2

    公开(公告)日：2022-05-03

    申请号：US16605088

    申请日：2017-10-18

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Chien-Hua Chen ,  Michael W Cumbie ,  Anthony D. Studer

    IPC: B41J2/175

    Abstract: In one example, a fluid property sensor includes an electrical circuit assembly (ECA), an elongated circuit (EC), and an external interface. The EC is attached to the ECA and includes multiple point sensors distributed along a length of the EC. The external interface is electrically coupled to a proximal end of the EC. The EC and the external interface are packaged together with an encasement on both sides of the ECA to form the fluid property sensor.

    FLUID LEVEL SENSOR
    5.
    发明申请
    FLUID LEVEL SENSOR 审中-公开

    公开(公告)号：US20190168511A1

    公开(公告)日：2019-06-06

    申请号：US16092652

    申请日：2016-04-21

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Anthony D. Studer

    IPC: B41J2/175 ,  G01F23/24

    Abstract: A method of forming a fluid level sensor includes coupling an array of heating elements and sensors to a first side of a substrate. A second side of the substrate is coupled to a carrier. The method also includes coupling an electrical interface to the carrier and electrically coupling the array to the electrical interface via a conductive wire. The method further includes overmolding the electrical interface, the first side of the substrate, and the conductive wire to form an overmolded fluid level sensor. The carrier may be coupled to the second side of the substrate and the electrical interface via a releasable adhesive and may be removed after overmolding the fluid level sensor.

    LIQUID LEVEL SENSING
    6.
    发明申请
    LIQUID LEVEL SENSING 审中-公开

    公开(公告)号：US20190111694A1

    公开(公告)日：2019-04-18

    申请号：US16092350

    申请日：2016-04-21

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Michael W. Cumbie ,  Chien-Hua Chen ,  Devin Alexander Mourey ,  Anthony D. Studer

    IPC: B41J2/175 ,  G01F23/24

    Abstract: In one example in accordance with the present disclosure a liquid level sensing device is described. The device includes a carrier and a liquid level sensing device disposed on the carrier. The liquid level sensing interface has an aspect ratio of at least 1:50. A number of liquid level sensing components are disposed on the liquid level sensing interface. The number of liquid level sensing components detect a liquid level in a liquid container. The liquid level sensing device also includes an electrical interconnect to output data collected from the number of liquid level sensing components.

    Fluid interface device with sliding needle
    9.
    发明授权
    Fluid interface device with sliding needle 有权

    公开(公告)号：US11312143B2

    公开(公告)日：2022-04-26

    申请号：US16616481

    申请日：2017-07-17

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Anthony D. Studer ,  Robert S. Wickwire

    IPC: B41J2/17 ,  B41J2/175

    Abstract: In one example in accordance with the present disclosure, a fluid interface device (106) is described. The device includes a collar (110) to receive a fluid container (104). The collar has an aperture in one end surface. A needle (108) of the fluid interface device passes through the aperture and allows fluid to pass from the fluid container (104) into a reservoir (102). The needle is slideable within the aperture from a dosed position to an open position upon reception of the fluid container. A seal (212) is radially disposed around the needle (108) and seals against the end surface of the collar (110) when the needle is in the dosed position.

    Fluid level sensor
    10.
    发明授权
    Fluid level sensor 有权

    公开(公告)号：US10647128B2

    公开(公告)日：2020-05-12

    申请号：US16092652

    申请日：2016-04-21

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Anthony D. Studer

    IPC: B41J2/175 ,  G01F23/24

    Abstract: A method of forming a fluid level sensor includes coupling an array of heating elements and sensors to a first side of a substrate. A second side of the substrate is coupled to a carrier. The method also includes coupling an electrical interface to the carrier and electrically coupling the array to the electrical interface via a conductive wire. The method further includes overmolding the electrical interface, the first side of the substrate, and the conductive wire to form an overmolded fluid level sensor. The carrier may be coupled to the second side of the substrate and the electrical interface via a releasable adhesive and may be removed after overmolding the fluid level sensor.

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