Invention Grant
- Patent Title: Gate structure in high-κ metal gate technology
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Application No.: US16580296Application Date: 2019-09-24
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Publication No.: US11335786B2Publication Date: 2022-05-17
- Inventor: Wei Cheng Wu , Alexander Kalnitsky , Shih-Hao Lo , Hung-Pin Ko
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/423 ; H01L29/66

Abstract:
Various embodiments of the present disclosure are directed towards a semiconductor device including a gate structure. The semiconductor device further includes a pair of spacer segments on a semiconductor substrate. A high-κ gate dielectric structure overlies the semiconductor substrate. The high-κ gate dielectric structure is laterally between and borders the spacer segments. The gate structure overlies the high-k gate dielectric structure and has a top surface about even with a top surface of the spacer segments. The gate structure includes a metal structure and a gate body layer. The gate body layer has a top surface that is vertically offset from a top surface of the metal structure and further has a lower portion cupped by the metal structure.
Public/Granted literature
- US20200251566A1 GATE STRUCTURE IN HIGH-K METAL GATE TECHNOLOGY Public/Granted day:2020-08-06
Information query
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