The present invention provides a polishing composition having a high polishing speed and a low etching speed and capable of achieving sufficient flattening.
The present invention is a polishing composition containing abrasive grains, an oxidizing agent, an acid, an anticorrosive containing a compound represented by the following formula (1) or a salt thereof, and a dispersing medium. (In the formula (1), R1 is a linear or branched alkyl group having 6 or more and 30 or less carbon atoms or a linear or branched alkenyl group having 6 or more and 30 or less carbon atoms, R2 is a single bond or an alkylene group having 1 or more and 4 or less carbon atoms, and R3 is a hydrogen atom or a linear or branched alkyl group having 1 or more and 10 or less carbon atoms.)