Invention Grant
- Patent Title: Polishing composition, production method of the same, polishing method, and manufacturing method of semiconductor substrate
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Application No.: US17208803Application Date: 2021-03-22
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Publication No.: US11339312B2Publication Date: 2022-05-24
- Inventor: Akiko Soumiya
- Applicant: FUJIMI INCORPORATED
- Applicant Address: JP Kiyosu
- Assignee: FUJIMI INCORPORATED
- Current Assignee: FUJIMI INCORPORATED
- Current Assignee Address: JP Kiyosu
- Agency: Foley & Lardner LLP
- Priority: JPJP2020-054516 20200325,JPJP2020-198712 20201130
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/3105 ; H01L21/306
Abstract:
The present invention provides means capable of improving an effect of inhibiting polishing of silicon nitride. The present invention relates to a polishing composition containing a cationically modified silica particles, a non-aromatic crosslinked cyclic compound having an organic acid group or a group of a salt thereof, and water.
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