Polishing composition, production method of the same, polishing method and a manufacturing method of a semiconductor substrate

    公开(公告)号:US12077680B2

    公开(公告)日:2024-09-03

    申请号:US17197246

    申请日:2021-03-10

    Inventor: Akiko Soumiya

    CPC classification number: C09G1/02 H01L21/3212

    Abstract: The present invention is to provide means for polishing an object to be polished containing titanium nitride at a high polishing speed. The present invention relates to a polishing composition containing silica particles and a polishing accelerator, wherein the polishing accelerator is a compound having an aromatic heterocyclic ring and an OH group or a group of a salt thereof directly bonded to the aromatic heterocyclic ring, or a compound having an aromatic hydrocarbon ring, an OH group or a group of a salt thereof directly bonded to the aromatic hydrocarbon ring, and a COOH group or a group of a salt thereof directly bonded to the aromatic hydrocarbon ring, and the polishing composition is used for polishing an object to be polished containing titanium nitride.

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