Invention Grant
- Patent Title: Die stack arrangement comprising a die-attach-film tape and method for producing same
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Application No.: US17023986Application Date: 2020-09-17
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Publication No.: US11342298B2Publication Date: 2022-05-24
- Inventor: Matthias Steiert , Karolina Gierl
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Priority: DE102018204772.3 20180328
- Main IPC: H01L23/00
- IPC: H01L23/00 ; B81B7/02 ; B81C1/00 ; H01L25/065 ; H01L21/56 ; H01L25/07 ; H01L21/67 ; H01L23/10 ; H01L23/13
Abstract:
A device includes a base substrate with a sensor component arranged thereon; a spacer layer on the base substrate, wherein the spacer layer is structured in order to predefine a cavity region, in which the sensor component is arranged in an exposed fashion on the base substrate, and a DAF tape element (DAF=Die-Attach-Film) on a stack element, wherein the DAF tape element mechanically fixedly connects the stack element to the spacer layer arranged on the base substrate and to obtain the cavity region.
Public/Granted literature
- US20210005568A1 Die Stack Arrangement Comprising a Die-Attach-Film Tape and Method for Producing Same Public/Granted day:2021-01-07
Information query
IPC分类:
