Invention Grant
- Patent Title: Stacked scalable voltage regulator module for platform area miniaturization
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Application No.: US16988759Application Date: 2020-08-10
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Publication No.: US11343906B2Publication Date: 2022-05-24
- Inventor: Tai Loong Wong , Fern Nee Tan , Tin Poay Chuah , Min Suet Lim , Siang Yeong Tan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Viering, Jentschura & Partner MBB
- Priority: MYPI2020002911 20200608
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/14

Abstract:
The present disclosure generally relates to a scalable computer circuit board having a first power level semiconductor package coupled to at least one base-level voltage regulator module, which is coupled to a plurality of connection receptacles that are configured for connecting with a voltage regulator module positioned on a second level, as a standardized base unit. To scale the base unit, a second power level semiconductor package may be exchanged for the first power level semiconductor package in conjunction with one or more voltage regulator module board being positioned over a corresponding number of base-level voltage regulator modules and coupled to their plurality of connection receptacles.
Public/Granted literature
- US20210385942A1 STACKED SCALABLE VOLTAGE REGULATOR MODULE FOR PLATFORM AREA MINIATURIZATION Public/Granted day:2021-12-09
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