Invention Grant
- Patent Title: Electrolytic copper foil having high-temperature dimensional stability and texture stability, and manufacturing method therefor
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Application No.: US16959360Application Date: 2019-01-25
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Publication No.: US11346015B2Publication Date: 2022-05-31
- Inventor: Seung Min Kim , Joong Kyu An , Shan Hua Jin
- Applicant: KCF Technologies Co., Ltd.
- Applicant Address: KR Anyang-si
- Assignee: KCF Technologies Co., Ltd.
- Current Assignee: KCF Technologies Co., Ltd.
- Current Assignee Address: KR Anyang-si
- Agency: K&L Gates LLP
- Priority: KR10-2018-0013092 20180201
- International Application: PCT/KR2019/001070 WO 20190125
- International Announcement: WO2019/151719 WO 20190808
- Main IPC: C25D7/06
- IPC: C25D7/06 ; C25D1/04 ; C25D3/38 ; H01M4/66 ; H01M10/052

Abstract:
The present invention relates to: an electrolytic copper foil having high dimensional stability and texture stability in a high temperature environment of a process for manufacturing an Li secondary battery; and a manufacturing method therefor. The electrolytic copper foil of the present invention has a thermal expansion coefficient of 17.1-22 μm/(m·° C.) in a temperature region of 30-190° C., has a variation of full width at half maximum of the (220) plane of 0.81-1.19 according to heat treatment for 30 minutes at 190° C., and has a weight deviation of 5% or less in the transverse direction.
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