公开(公告)号：US10658655B2

公开(公告)日：2020-05-19

申请号：US16113479

申请日：2018-08-27

Applicant: KCF Technologies Co., Ltd.

Inventor： Young Wook Chae ,  Young Hyun Kim ,  Shan Hua Jin

IPC: H01M4/66 ,  H01M4/134 ,  H01M4/1395 ,  H01M4/04 ,  C25D3/38 ,  C25D5/56 ,  C25D1/04 ,  H01M4/02 ,  H01M10/0525 ,  H01M4/133 ,  H01M4/36

Abstract: Disclosed is a copper foil including a copper layer having a matte surface and a shiny surface, wherein the copper foil has a first surface of a direction of the matte surface of the copper layer and a second surface of a direction of the shiny surface of the copper layer, wherein a dynamic friction coefficient of the first surface is designated by μk1 and a dynamic friction coefficient of the second surface is designated by μk2. A ratio of three-dimensional surface area to two-dimensional surface area of the first surface is designated by Fs1, a ratio of three-dimensional surface area to two-dimensional surface area of the second surface is designated by Fs2.

公开(公告)号：US11346015B2

公开(公告)日：2022-05-31

申请号：US16959360

申请日：2019-01-25

Applicant: KCF Technologies Co., Ltd.

Inventor： Seung Min Kim ,  Joong Kyu An ,  Shan Hua Jin

IPC: C25D7/06 ,  C25D1/04 ,  C25D3/38 ,  H01M4/66 ,  H01M10/052

Abstract: The present invention relates to: an electrolytic copper foil having high dimensional stability and texture stability in a high temperature environment of a process for manufacturing an Li secondary battery; and a manufacturing method therefor. The electrolytic copper foil of the present invention has a thermal expansion coefficient of 17.1-22 μm/(m·° C.) in a temperature region of 30-190° C., has a variation of full width at half maximum of the (220) plane of 0.81-1.19 according to heat treatment for 30 minutes at 190° C., and has a weight deviation of 5% or less in the transverse direction.

公开(公告)号：US11505873B2

公开(公告)日：2022-11-22

申请号：US16631739

申请日：2018-07-25

Applicant: KCF Technologies Co., Ltd.

Inventor： Shan Hua Jin ,  An Na Lee ,  Seung Min Kim

IPC: C25D7/04 ,  C25D1/04 ,  C25D3/38 ,  C25D5/34 ,  C25D5/48 ,  H01M4/13 ,  H01M4/66 ,  H01M10/052 ,  B32B15/01

Abstract: Disclosed is a copper foil including a copper layer having a matte surface and a shiny surface, and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a residual stress of 0.5 to 25 Mpa, based on absolute value, and the copper layer has a plurality of crystal planes, wherein a ratio [TCR (220)] of a texture coefficient (TC) of (220) crystal plane of the copper layer to a total of texture coefficients (TC) of (111), (200), (220) and (311) crystal planes of the copper layer is 5 to 30%.

公开(公告)号：US11352707B2

公开(公告)日：2022-06-07

申请号：US15999169

申请日：2018-08-17

Applicant: KCF Technologies Co., Ltd.

Inventor： Seung Min Kim ,  An Na Lee ,  Ho Gun Kim ,  Shan Hua Jin

IPC: C25D1/04 ,  C25D3/38 ,  H05K1/09 ,  H01M4/66 ,  C25D7/06 ,  C25D3/58 ,  C25D5/00 ,  H05K1/03 ,  H05K3/02 ,  H01M10/0525

Abstract: Disclosed is a copper foil including a copper layer and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a peak to arithmetic mean roughness (PAR) of 0.8 to 12.5, a tensile strength of 29 to 58 kgf/mm2, and a weight deviation of 3% or less, wherein the PAR is calculated in accordance with the following Equation 1: PAR=Rp/Ra  [Equation 1] wherein Rp is a maximum profile peak height and Ra is an arithmetic mean roughness.