- 专利标题： Laser soldering system
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申请号： US15234091申请日： 2016-08-11
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公开(公告)号： US11351622B2公开(公告)日： 2022-06-07
- 发明人: Hongzhou Shen , Dandan Zhang , Roberto Francisco-Yi Lu , George J. Dubniczki , Qinglong Zeng
- 申请人： Tyco Electronics (Shanghai) Co. Ltd. , Tyco Electronics Corporation , Tyco Electronics (Dongguan) Ltd
- 申请人地址： CN Shanghai; US PA Berwyn; CN Guangdong
- 专利权人： Tyco Electronics (Shanghai) Co. Ltd.,Tyco Electronics Corporation,Tyco Electronics (Dongguan) Ltd
- 当前专利权人： Tyco Electronics (Shanghai) Co. Ltd.,Tyco Electronics Corporation,Tyco Electronics (Dongguan) Ltd
- 当前专利权人地址： CN Shanghai; US PA Berwyn; CN Guangdong
- 代理机构： Barley Snyder
- 优先权： CN2014100511350 20140213
- 主分类号： B23K1/005
- IPC分类号： B23K1/005 ; B23K26/08 ; B23K20/00 ; B23K26/00 ; H05K3/34 ; B23K3/08 ; B23K101/32 ; B23K101/42
摘要：
A laser soldering system is disclosed. The laser soldering system has a moving system, a gripper mounted on the moving system, a presser mounted on the moving system and having a transparent member, and a laser. The gripper grips an object and places the object at a target location on a product to be soldered. The transparent member presses the object against the product. The laser emits a laser beam through the transparent member to solder the object to the target location while the object is pressed against the product.
公开/授权文献
- US20160346858A1 Laser Soldering System 公开/授权日：2016-12-01
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