Invention Grant
- Patent Title: Bimodal PHY for low latency in high speed interconnects
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Application No.: US17184737Application Date: 2021-02-25
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Publication No.: US11354264B2Publication Date: 2022-06-07
- Inventor: Venkatraman Iyer , William R. Halleck , Rahul R. Shah , Eric Lee
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/38 ; G06F13/42 ; G06F13/16

Abstract:
Systems, methods, and apparatuses including a Physical layer (PHY) block coupled to a Media Access Control layer (MAC) block via a PHY/MAC interface. Each of the PHY and MAC blocks include a plurality of Physical Interface for PCI Express (PIPE) registers. The PHY/MAC interface includes a low pin count PIPE interface comprising a small set of wires coupled between the PHY block and the MAC block. The MAC block is configured to multiplex command, address, and data over the low pin count PIPE interface to access the plurality of PHY PIPE registers, and the PHY block is configured to multiplex command, address, and data over the low pin count PIPE interface to access the plurality of MAC PIPE registers. The PHY block may also be selectively configurable to implement a PIPE architecture to operate in a PIPE mode and a serialization and deserialization (SERDES) architecture to operate in a SERDES mode.
Public/Granted literature
- US20210182231A1 BIMODAL PHY FOR LOW LATENCY IN HIGH SPEED INTERCONNECTS Public/Granted day:2021-06-17
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