Invention Grant
- Patent Title: Package lead design with grooves for improved dambar separation
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Application No.: US16510448Application Date: 2019-07-12
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Publication No.: US11362023B2Publication Date: 2022-06-14
- Inventor: Jayaganasan Narayanasamy , Meng How Chong , Elmer Senorin Holgado , Chee Ming Lam , Sanjay Kumar Murugan , Arivindran Navaretnasinggam , Kai Yang Tan , Lee Shuang Wang
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48 ; H01L21/56 ; H01L23/31
Abstract:
A lead frame includes a die pad, a first lead extending away from the die pad, a peripheral structure mechanically connected to the first lead and the die pad, and a first groove in an outer surface of the first lead. The first groove extends longitudinally along the first lead away from the die pad.
Public/Granted literature
- US20210013135A1 Package Lead Design with Grooves for Improved Dambar Separation Public/Granted day:2021-01-14
Information query
IPC分类:
