公开(公告)号：US11362023B2

公开(公告)日：2022-06-14

申请号：US16510448

申请日：2019-07-12

Applicant: Infineon Technologies AG

Inventor： Jayaganasan Narayanasamy ,  Meng How Chong ,  Elmer Senorin Holgado ,  Chee Ming Lam ,  Sanjay Kumar Murugan ,  Arivindran Navaretnasinggam ,  Kai Yang Tan ,  Lee Shuang Wang

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: A lead frame includes a die pad, a first lead extending away from the die pad, a peripheral structure mechanically connected to the first lead and the die pad, and a first groove in an outer surface of the first lead. The first groove extends longitudinally along the first lead away from the die pad.

公开(公告)号：US20210013135A1

公开(公告)日：2021-01-14

申请号：US16510448

申请日：2019-07-12

Applicant: Infineon Technologies AG

Inventor： Jayaganasan Narayanasamy ,  Meng How Chong ,  Elmer Senorin Holgado ,  Chee Ming Lam ,  Sanjay Kumar Murugan ,  Arivindran Navaretnasinggam ,  Kai Yang Tan ,  Lee Shuang Wang

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A lead frame includes a die pad, a first lead extending away from the die pad, a peripheral structure mechanically connected to the first lead and the die pad, and a first groove in an outer surface of the first lead. The first groove extends longitudinally along the first lead away from the die pad.