公开(公告)号：US20200294896A1

公开(公告)日：2020-09-17

申请号：US16351211

申请日：2019-03-12

Applicant: Infineon Technologies AG

Inventor： Arivindran Navaretnasinggam ,  Xavier Arokiasamy ,  Thomas Bemmerl ,  Ke Yan Tean

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L23/00

Abstract: A packaged semiconductor device includes a die paddle, a semiconductor die mounted on the die paddle, a plurality of fused leads extending away from a first side of the die paddle, a discrete lead that extends away from the first side of the die paddle and is physically detached from the plurality of fused leads, a first electrical connection between a first terminal of the semiconductor die and the discrete lead, an encapsulation material that encapsulates the semiconductor die, and a stabilizer bar connected to a first outer edge side of the discrete lead. The first outer edge side of the discrete lead is opposite from a second outer edge side of the discrete lead which faces the plurality of fused leads.

公开(公告)号：US11362023B2

公开(公告)日：2022-06-14

申请号：US16510448

申请日：2019-07-12

Applicant: Infineon Technologies AG

Inventor： Jayaganasan Narayanasamy ,  Meng How Chong ,  Elmer Senorin Holgado ,  Chee Ming Lam ,  Sanjay Kumar Murugan ,  Arivindran Navaretnasinggam ,  Kai Yang Tan ,  Lee Shuang Wang

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: A lead frame includes a die pad, a first lead extending away from the die pad, a peripheral structure mechanically connected to the first lead and the die pad, and a first groove in an outer surface of the first lead. The first groove extends longitudinally along the first lead away from the die pad.

公开(公告)号：US20210013135A1

公开(公告)日：2021-01-14

申请号：US16510448

申请日：2019-07-12

Applicant: Infineon Technologies AG

Inventor： Jayaganasan Narayanasamy ,  Meng How Chong ,  Elmer Senorin Holgado ,  Chee Ming Lam ,  Sanjay Kumar Murugan ,  Arivindran Navaretnasinggam ,  Kai Yang Tan ,  Lee Shuang Wang

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A lead frame includes a die pad, a first lead extending away from the die pad, a peripheral structure mechanically connected to the first lead and the die pad, and a first groove in an outer surface of the first lead. The first groove extends longitudinally along the first lead away from the die pad.