A polymer composition for use in a hot melt adhesive comprises at least one semierystalline, low molecular weight (LMW) propylene-based polymer; at least one essentially amorphous, high molecular weight (HMW) propylene-based polymer; and at least one essentially amorphous, LMW propylene-based polymer. A hot melt adhesive composition further contains a tackifier, a plasticizer, an antioxidant, and optionally a wax, a filler, a colorant, a UV absorber, another polymer, or combinations thereof. The hot melt adhesive is useful for a variety of industrial applications where bonding of low surface energy substrates is encountered, including disposable nonwoven hygienic articles, labeling and other assembly applications. Particularly preferred applications include nonwoven disposable diaper and feminine sanitary napkin construction, diaper and adult incontinent brief elastic attachment, diaper and napkin core stabilization, diaper backsheet lamination, industrial filter material conversion, and surgical gown and surgical drape assemblies. The composition demonstrates improved peel strength while maintaining very good creep resistance.