Invention Grant
- Patent Title: Multilayer electronic component production method
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Application No.: US16622572Application Date: 2018-09-19
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Publication No.: US11387023B2Publication Date: 2022-07-12
- Inventor: Ken Yanai , Tomokazu Yamaguchi , Yuji Yamagishi , Naoki Mutou , Sayaka Matsumoto , Ryosuke Usui
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JPJP2017-197380 20171011
- International Application: PCT/JP2018/034534 WO 20180919
- International Announcement: WO2019/073762 WO 20190418
- Main IPC: H01G7/00
- IPC: H01G7/00 ; H01C17/30 ; H01C7/10 ; H01C7/18 ; H01C17/28

Abstract:
A sintered body that includes ceramic layers and an internal electrode which are alternately stacked on one another is prepared. A first external electrode is formed on a side surface of the sintered body such that the first external electrode is connected to the internal electrode. An insulating layer is formed on a surface of the sintered body by applying a glass coating over an entire of the sintered body having the formed first external electrode. The insulating layer is exposed from the first external electrode. A second external electrode is formed on the first external electrode. This method provides the produced multilayer electronic component with a stable electric connection between the internal electrodes and the external electrodes.
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