- Patent Title: Microelectronic device with embedded die substrate on interposer
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Application No.: US16474026Application Date: 2017-03-29
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Publication No.: US11430740B2Publication Date: 2022-08-30
- Inventor: Robert Alan May , Islam A. Salama , Sri Ranga Sai Boyapati , Sheng Li , Kristof Darmawikarta , Robert L. Sankman , Amruthavalli Pallavi Alur
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- International Application: PCT/US2017/024795 WO 20170329
- International Announcement: WO2018/182597 WO 20181004
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/31 ; H01L25/07 ; H01L25/11 ; H01L23/538 ; H01L21/56 ; H01L21/683 ; H01L23/00 ; H01L25/065
Abstract:
Microelectronic devices with an embedded die substrate on an interposer are described. For example, a microelectronic device includes a substrate housing an embedded die. At least one surface die is retained above a first outermost surface of the substrate. An interposer is retained proximate a second outermost surface of the substrate.
Public/Granted literature
- US20190341351A1 MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER Public/Granted day:2019-11-07
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