Invention Grant
- Patent Title: Conductive material composition and conductive material prepared therefrom
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Application No.: US16731680Application Date: 2019-12-31
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Publication No.: US11437162B2Publication Date: 2022-09-06
- Inventor: Ying-Xuan Lai , Shou-Yi Ho , Yi-Chi Yang , Yen-Chun Liu
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01B1/22
- IPC: H01B1/22 ; C08K3/08 ; C08L81/04 ; B82Y30/00

Abstract:
A conductive material composition and a conductive material prepared therefrom are provided. The conductive material composition includes 40-80 parts by weight of disulfide resin having at least one terminal reactive functional group and 20-60 parts by weight of metal material. The terminal reactive functional group is independently acrylate group, methacrylate group, glycidyl group, oxiranyl group, oxetanyl group, or 3,4-epoxycyclohexyl group.
Public/Granted literature
- US20210202126A1 CONDUCTIVE MATERIAL COMPOSITION AND CONDUCTIVE MATERIAL PREPARED THEREFROM Public/Granted day:2021-07-01
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