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公开(公告)号：US11015018B2
公开(公告)日：2021-05-25
申请号：US16146084
申请日：2018-09-28
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Yen-Chun Liu , Min-Chian Wang , Hsiang-Yen Tsao , Kuo-Chan Chiou
IPC: C08G59/52 , C08G59/50 , C08K3/22 , C08G59/22 , C08G59/24 , C08G59/56 , C09D163/00 , C09K5/14 , C08L63/00 , C08K3/08 , C08K3/013
Abstract: A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.
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公开(公告)号：US10059866B2
公开(公告)日：2018-08-28
申请号：US14974616
申请日：2015-12-18
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Yen-Chun Liu , Hui-Wen Chang , Hsiang-Yen Tsao , Kuo-Chan Chiou
IPC: C08L63/00 , C08G59/24 , C08G59/50 , C09K5/14 , C08G59/22 , H01L23/373 , C09J163/00 , B32B27/38
CPC classification number: C09K5/14 , C08G59/22 , C08G59/226 , C08G59/24 , C08G59/245 , C08G59/50 , C08G59/5033 , H01L23/3737
Abstract: An epoxy resin composition is provided. The epoxy resin composition includes a first aromatic epoxy resin represented by formula (I), and an amino compound selected from a group that includes 4,4′-methylenedianiline, 4,4′-ethylenedianiline, 4,4′-bis(4-aminophenoxy)biphenyl and 1,4-bis(4-aminophenoxy)benzene, wherein the ratio between the epoxy groups of the first aromatic epoxy resin and the amino groups of the amino compound ranges from 1:1 to 2:1.
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Patent Agency Ranking
公开(公告)号：US10329468B2
公开(公告)日：2019-06-25
申请号：US15046973
申请日：2016-02-18
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Yen-Chun Liu , Hui-Wen Chang , Min-Chian Wang , Kuo-Chan Chiou
Abstract: A thermally conductive resin is provided. The thermally conductive resin has the formula In the formula, X1 is X2 is m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.
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公开(公告)号：US11437162B2
公开(公告)日：2022-09-06
申请号：US16731680
申请日：2019-12-31
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Ying-Xuan Lai , Shou-Yi Ho , Yi-Chi Yang , Yen-Chun Liu
Abstract: A conductive material composition and a conductive material prepared therefrom are provided. The conductive material composition includes 40-80 parts by weight of disulfide resin having at least one terminal reactive functional group and 20-60 parts by weight of metal material. The terminal reactive functional group is independently acrylate group, methacrylate group, glycidyl group, oxiranyl group, oxetanyl group, or 3,4-epoxycyclohexyl group.
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公开(公告)号：US11383195B2
公开(公告)日：2022-07-12
申请号：US16904877
申请日：2020-06-18
Applicant: Industrial Technology Research Institute
Inventor： Tsung-Jen Ho , Sheng-Fu Huang , Yen-Chun Liu , Chun-Yi Chou
Abstract: A device for capturing particles includes a gas-guiding unit, a gas-guiding unit and a mist-elimination unit. The gas-guiding unit has opposing first and second ends. The mist-elimination unit is disposed at the second end. The liquid-circulation unit, disposed under the mist-elimination unit by surrounding the gas-guiding unit, includes through holes below the gas-guiding unit by a gap. A gas containing particles enters the channel via the first end and then the mist-elimination unit via the second end. While the gas flows into the channel, the liquid in the liquid-circulation unit is inhaled into the channel via the gap to form droplets containing particles. After the droplets are captured by the mist-elimination unit, the liquid formed at the mist-elimination unit flows down into the liquid-circulation unit to reform the liquid to be further inhaled back to the channel of the gas-guiding unit via the gap.
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公开(公告)号：US11286333B2
公开(公告)日：2022-03-29
申请号：US16727285
申请日：2019-12-26
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Kuei-Yi Chuang , Kuo-Chan Chiou , Yen-Chun Liu
Abstract: A degradation method of thermosetting resin is provided. The method includes the following steps, for example, a first resin composition is provided. The resin in the first resin composition includes a carbon-nitrogen bond, an ether bond, an ester bond or a combination thereof. The first resin composition and a catalyst composition are mixed to perform a degradation reaction to form a second resin composition. The catalyst composition includes a transition metal compound and a group IIIA metal compound. The second resin composition includes a resin monomer or an oligomer thereof having functional groups. The functional group includes an amine group, a hydroxyl group, an ester group, an acid group or a combination thereof. A catalyst composition used in the degradation method and a resin composition obtained by the degradation method are also provided.
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公开(公告)号：US09371233B2
公开(公告)日：2016-06-21
申请号：US14484430
申请日：2014-09-12
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Chen-Lung Lin , Yen-Chun Liu , Hui-Wen Chang , Kuo-Chan Chiou , Hsien-Lin Hu
IPC: C01B31/04 , C08G73/14 , C09D179/08 , C08G73/10
CPC classification number: C01B31/04 , C01B32/20 , C08G73/1035 , C08G73/1042 , C08G73/1053 , C08G73/1067 , C08G73/1071 , C08G73/14 , C09D179/08
Abstract: A polyamide-imide represented by the following formula is provided. A graphite film prepared by performing a thermal treatment process on the polyamide-imide represented by the above-mentioned formula is also provided. In the thermal treatment process, the temperature range of the thermal treatment process ranges from 25° C. to 2,900° C.
Abstract translation: 提供由下式表示的聚酰胺 - 酰亚胺。 还提供了通过对由上述式表示的聚酰胺 - 酰亚胺进行热处理工艺制备的石墨膜。 在热处理过程中，热处理工艺的温度范围为25℃至2900℃。
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