Invention Grant
- Patent Title: Semiconductor device and method of manufacture
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Application No.: US16900439Application Date: 2020-06-12
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Publication No.: US11437280B2Publication Date: 2022-09-06
- Inventor: Chia-Ching Lee , Hsin-Han Tsai , Shih-Hang Chiu , Tsung-Ta Tang , Chung-Chiang Wu , Hung-Chin Chung , Hsien-Ming Lee , Da-Yuan Lee , Jian-Hao Chen , Chien-Hao Chen , Kuo-Feng Yu , Chia-Wei Chen , Chih-Yu Hsu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L27/088 ; H01L29/40 ; H01L29/66

Abstract:
A dummy gate electrode and a dummy gate dielectric are removed to form a recess between adjacent gate spacers. A gate dielectric is deposited in the recess, and a barrier layer is deposited over the gate dielectric. A first work function layer is deposited over the barrier layer. A first anti-reaction layer is formed over the first work function layer, the first anti-reaction layer reducing oxidation of the first work function layer. A fill material is deposited over the first anti-reaction layer.
Public/Granted literature
- US20210391219A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE Public/Granted day:2021-12-16
Information query
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