Invention Grant
- Patent Title: Encapsulation cover for an electronic package and fabrication process
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Application No.: US16896780Application Date: 2020-06-09
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Publication No.: US11437527B2Publication Date: 2022-09-06
- Inventor: Karine Saxod , Veronique Ferre , Agnes Baffert , Jean-Michel Riviere
- Applicant: STMicroelectronics (Grenoble 2) SAS
- Applicant Address: FR Grenoble
- Assignee: STMicroelectronics (Grenoble 2) SAS
- Current Assignee: STMicroelectronics (Grenoble 2) SAS
- Current Assignee Address: FR Grenoble
- Agency: Crowe & Dunlevy
- Priority: FR1761101 20171123
- Main IPC: H01L31/0203
- IPC: H01L31/0203 ; H01L21/56 ; H01L31/0232 ; H01L31/18 ; H01L31/16 ; H01L31/12 ; H01L33/48

Abstract:
An encapsulation cover for an electronic package includes a frontal wall with a through-passage extending between faces. The frontal wall includes an optical element that allows light to pass through the through-passage. A cover body and a metal insert that is embedded in the cover body, with the cover body being overmolded over the metal insert, defines at least part of the frontal wall.
Public/Granted literature
- US20200303565A1 ENCAPSULATION COVER FOR AN ELECTRONIC PACKAGE AND FABRICATION PROCESS Public/Granted day:2020-09-24
Information query
IPC分类: