Invention Grant
- Patent Title: Lithography mask with an amorphous capping layer
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Application No.: US16872212Application Date: 2020-05-11
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Publication No.: US11442356B2Publication Date: 2022-09-13
- Inventor: Hsin-Chang Lee , Pei-Cheng Hsu , Chih-Tao Chien , Ming-Wei Chen , Ta-Cheng Lien
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G03F1/24
- IPC: G03F1/24 ; G03F1/38 ; G03F1/48

Abstract:
A multi-layer reflective structure is disposed over the substrate. An amorphous capping layer is disposed over the multi-layer reflective structure. The amorphous capping layer may contain ruthenium, oxygen, niobium, nitrogen, tantalum, or zirconium. An amorphous layer may also be disposed between the multi-layer reflective structure and the amorphous capping layer. The amorphous layer includes amorphous silicon, amorphous silicon oxide, or amorphous silicon nitride.
Public/Granted literature
- US20210349386A1 Lithography Mask with an Amorphous Capping Layer Public/Granted day:2021-11-11
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