Invention Grant
- Patent Title: System, apparatus and method for synchronizing multiple virtual link states over a package interconnect
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Application No.: US16426361Application Date: 2019-05-30
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Publication No.: US11442876B2Publication Date: 2022-09-13
- Inventor: Joon Teik Hor , Ting Lok Song , Mahesh Wagh , Su Wei Lim
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: G06F13/16
- IPC: G06F13/16 ; G06F13/40 ; G06F13/42

Abstract:
In one embodiment, an apparatus includes an arbitration circuit with virtual link state machines to virtualize link states associated with multiple communication protocol stacks. The apparatus further includes a physical circuit coupled to the arbitration circuit and to interface with a physical link, where the physical circuit, in response to a retraining of the physical link, is to cause a plurality of the virtual link state machines to synchronize with corresponding virtual link state machines associated with a second side of the physical link, and where at least one of the communication protocol stacks is to remain in a low power state during the retraining and the synchronization. Other embodiments are described and claimed.
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