Invention Grant
- Patent Title: FinFET device and methods of forming
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Application No.: US17013615Application Date: 2020-09-06
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Publication No.: US11450757B2Publication Date: 2022-09-20
- Inventor: Yu-Chang Lin , Chun-Feng Nieh , Huicheng Chang , Wei-Ting Chien , Chih-Pin Tsao , Hou-Ju Li , Tien-Shun Chang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/8238 ; H01L29/78 ; H01L27/092 ; H01L21/225 ; H01L21/324 ; H01L29/08

Abstract:
A finFET device and methods of forming a finFET device are provided. The method includes depositing a dummy gate over and along sidewalls of a fin extending upwards from a semiconductor substrate, forming a first gate spacer along a sidewall of the dummy gate, and plasma-doping the first gate spacer with carbon to form a carbon-doped gate spacer. The method further includes forming a source/drain region adjacent a channel region of the fin and diffusing carbon from the carbon-doped gate spacer into a first region of the fin to provide a first carbon-doped region. The first carbon-doped region is disposed between at least a portion of the source/drain region and the channel region of the fin.
Information query
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