Invention Grant
- Patent Title: Chemical mechanical polishing apparatus and methods
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Application No.: US16691581Application Date: 2019-11-21
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Publication No.: US11453097B2Publication Date: 2022-09-27
- Inventor: Rajeev Bajaj , Thomas H. Osterheld , Hung Chen , Terrance Y. Lee
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: B24B37/04
- IPC: B24B37/04 ; B24B57/02 ; H01L21/67 ; H01L21/321 ; H01L21/306 ; H01L21/304 ; B24B37/11 ; B24B37/30
Abstract:
A substrate polishing apparatus is disclosed that includes a polishing platform having two or more zones, each zone adapted to receive a different slurry component. A substrate polishing system is provided having a holder to hold a substrate, a polishing platform having a polishing pad, and a distribution system adapted to dispense, in a timed sequence, at least two different slurry components selected from a group consisting of an oxidation slurry component, a material removal slurry component, and a corrosion inhibiting slurry component. Polishing methods and systems adapted to polish substrates are provided, as are numerous other aspects.
Public/Granted literature
- US20200086452A1 Chemical Mechanical Polishing Apparatus and Methods Public/Granted day:2020-03-19
Information query
