Invention Grant
- Patent Title: Thermal assemblies for multi-chip packages
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Application No.: US16100406Application Date: 2018-08-10
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Publication No.: US11456232B2Publication Date: 2022-09-27
- Inventor: Zhimin Wan , Je-Young Chang , Chia-Pin Chiu , Shankar Devasenathipathy , Betsegaw Kebede Gebrehiwot , Chandra Mohan Jha
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Akona IP PC
- Main IPC: H01L23/427
- IPC: H01L23/427 ; H01L25/18
Abstract:
Disclosed herein are thermal assemblies for multi-chip packages (MCPs), as well as related methods and devices. For example, in some embodiments, a thermal assembly for an MCP may include a heat pipe having a ring shape.
Public/Granted literature
- US20200051894A1 THERMAL ASSEMBLIES FOR MULTI-CHIP PACKAGES Public/Granted day:2020-02-13
Information query
IPC分类:
