发明授权
- 专利标题： Integrated circuit
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申请号： US17138150申请日： 2020-12-30
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公开(公告)号： US11456262B2公开(公告)日： 2022-09-27
- 发明人: Yuki Sato , Kenji Otake , Takafumi Ando , Jeffrey Morroni , Charles Allen Devries, Jr. , Kristen Nguyen Parrish
- 申请人： TEXAS INSTRUMENTS INCORPORATED
- 申请人地址： US TX Dallas
- 专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人地址： US TX Dallas
- 代理商 Michael A. Davis, Jr.; Charles A. Brill; Frank D. Cimino
- 主分类号： H01L23/64
- IPC分类号： H01L23/64 ; H01L49/02 ; H01L23/31 ; H01L21/78 ; H01L21/48 ; H01L21/56 ; H01L23/495
摘要：
An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate and the substrate-based coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the substrate-based coil and the electronic component.
公开/授权文献
- US20210343662A1 INTEGRATED CIRCUIT 公开/授权日：2021-11-04
信息查询
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