公开(公告)号：US20220244638A1

公开(公告)日：2022-08-04

申请号：US17512959

申请日：2021-10-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hidetoshi Inoue ,  Kenji Kawano ,  Yuki Sato ,  Takafumi Ando ,  Michael Lueders ,  Stefan Herzer ,  Jeffrey Morroni

IPC: G03F7/00 ,  H01L21/027

Abstract: A permanent resist, such as TMMF, is used when patterning conductive material on a substrate, enabling lines that have a higher line-to-space ratio (L/S) or a higher aspect ratio (T/L) or both. Pattern density can thus be increased, allowing for improved performance (e.g., greater efficiency, in the case of transformer coil patterning) and greater heat dissipation. As examples, the permanent-resist-based patterning fabrication methods can be used to create transformer coils within an integrated circuit (IC) module, or a routable lead frame for one or more IC dies.

公开(公告)号：US20210343662A1

公开(公告)日：2021-11-04

申请号：US17138150

申请日：2020-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuki Sato ,  Kenji Otake ,  Takafumi Ando ,  Jeffrey Morroni ,  Charles Allen Devries, JR. ,  Kristen Nguyen Parrish

IPC: H01L23/64 ,  H01L49/02 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate and the substrate-based coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the substrate-based coil and the electronic component.

公开(公告)号：US20180122731A1

公开(公告)日：2018-05-03

申请号：US15488594

申请日：2017-04-17

Applicant: Texas Instruments Incorporated

Inventor： Daiki Komatsu ,  Takafumi Ando

IPC: H01L23/498 ,  H01L21/78 ,  H01L21/48 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49805 ,  H01L21/4828 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2224/85 ,  H01L2224/32245 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit chip package and method for making the same, wherein the integrated circuit chip package includes conductive leads. The method includes trenching a plurality of conductive lead structures along a parting line, plating the trenches with a plating layer, and singulating the lead frame assembly along the parting line to produce an integrated circuit chip package with conductive leads having unplated side portions and plated recessed portions.

公开(公告)号：US11869855B2

公开(公告)日：2024-01-09

申请号：US17953162

申请日：2022-09-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Zhemin Zhang ,  Kenji Otake ,  Yi Yan ,  Jeffrey Morroni ,  Yuki Sato ,  Takafumi Ando

IPC: H01L23/64 ,  H01F27/28 ,  H01F41/06 ,  H01F41/02 ,  H01F17/04 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L49/02 ,  H01F27/02

CPC classification number: H01L23/645 ,  H01F17/04 ,  H01F27/022 ,  H01F27/28 ,  H01F41/0206 ,  H01F41/06 ,  H01L21/4842 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49503 ,  H01L28/10

Abstract: In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.

公开(公告)号：US20240006259A1

公开(公告)日：2024-01-04

申请号：US17852979

申请日：2022-06-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hidetoshi Inoue ,  Kenji Otake ,  Yuki Sato ,  Takafumi Ando ,  Jeffrey Morroni ,  Anton Winkler ,  Yi Yan

IPC: H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16 ,  H01L49/02 ,  H01L21/56 ,  H01F27/32 ,  H01F41/00

CPC classification number: H01L23/295 ,  H01L24/16 ,  H01L23/3128 ,  H01L25/165 ,  H01L28/10 ,  H01L2224/81447 ,  H01L24/81 ,  H01L21/561 ,  H01F27/327 ,  H01F41/005 ,  H01L2224/16227 ,  H01L28/40

Abstract: In one example, an integrated circuit comprises: a substrate; a semiconductor die; metal interconnects, the semiconductor die being mounted to the substrate via the metal interconnects; an inductor mounted to the substrate; and a magnetic material encapsulating the semiconductor die, the inductor, and the metal interconnects, the magnetic material including: coated metal particles, which are coated with a first insulation material; and a second insulation material, in which the coated metal particles are suspended.

公开(公告)号：US20230013938A1

公开(公告)日：2023-01-19

申请号：US17947288

申请日：2022-09-19

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuki Sato ,  Kenji Otake ,  Takafumi Ando ,  Jeffrey Morroni ,  Charles Allen Devries, JR. ,  Kristen Nguyen Parrish

IPC: H01L23/64 ,  H01L49/02 ,  H01L23/31 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495

Abstract: An integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate. The coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the coil and the electronic component.

公开(公告)号：US11488914B2

公开(公告)日：2022-11-01

申请号：US16581033

申请日：2019-09-24

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Zhemin Zhang ,  Kenji Otake ,  Yi Yan ,  Jeffrey Morroni ,  Yuki Sato ,  Takafumi Ando

IPC: H01L23/64 ,  H01F41/06 ,  H01F41/02 ,  H01F17/04 ,  H01F27/28 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L49/02 ,  H01F27/02

Abstract: In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.

公开(公告)号：US11456262B2

公开(公告)日：2022-09-27

申请号：US17138150

申请日：2020-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuki Sato ,  Kenji Otake ,  Takafumi Ando ,  Jeffrey Morroni ,  Charles Allen Devries, Jr. ,  Kristen Nguyen Parrish

IPC: H01L23/64 ,  H01L49/02 ,  H01L23/31 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495

Abstract: An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate and the substrate-based coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the substrate-based coil and the electronic component.