公开(公告)号：US11855540B2

公开(公告)日：2023-12-26

申请号：US16364492

申请日：2019-03-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Charles Allen DeVries, Jr. ,  Kyle Brent Norell ,  Kristen Nguyen Parrish

IPC: H01F27/29 ,  H02M3/158 ,  H01F41/04 ,  H01F27/28 ,  H01F38/02

CPC classification number: H02M3/1582 ,  H01F27/2804 ,  H01F41/04 ,  H01F2038/026

Abstract: A device includes a circuit assembly and a first conductive winding support having a first end attached to the circuit assembly and having a first winding support surface a first distance from the circuit assembly. The device also includes a second conductive winding support having a second end attached to the circuit assembly and having a second winding support surface a second distance from the circuit assembly, the second distance being different than the first distance. A conductive winding has first and second winding ends. The first winding end is attached to the first winding support surface, and the second winding end is attached to the second winding support surface.

公开(公告)号：US20200219735A1

公开(公告)日：2020-07-09

申请号：US16818849

申请日：2020-03-13

Applicant: Texas Instruments Incorporated

Inventor： Kristen Nguyen Parrish ,  Charles Devries

IPC: H01L21/56 ,  H01F27/40 ,  H01F27/28 ,  H01F17/04 ,  H01F27/30 ,  H01L23/495 ,  H01L21/78 ,  H01F27/24 ,  H02M1/08 ,  H02M3/155 ,  H01L21/48

Abstract: A method for manufacturing a switch-mode converter includes forming a plurality of windings by coiling one or more conductors. Each of the windings is secured to one of a plurality of module bases arranged in a module array. At least one side of the array is encapsulated in a magnetic mold compound.

公开(公告)号：US10593566B2

公开(公告)日：2020-03-17

申请号：US15855706

申请日：2017-12-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Kristen Nguyen Parrish ,  Charles Devries

IPC: H01L21/56 ,  H01L23/495 ,  H01L21/48 ,  H01F27/28 ,  H02M3/155 ,  H02M1/08 ,  H01F27/24 ,  H01L21/78 ,  H01F27/30 ,  H01F17/04 ,  H01F27/40

Abstract: A method for manufacturing a switch-mode converter includes forming a plurality of windings by coiling one or more conductors. Each of the windings is secured to one of a plurality of module bases arranged in a module array. At least one side of the array is encapsulated in a magnetic mold compound.

公开(公告)号：US20230013938A1

公开(公告)日：2023-01-19

申请号：US17947288

申请日：2022-09-19

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuki Sato ,  Kenji Otake ,  Takafumi Ando ,  Jeffrey Morroni ,  Charles Allen Devries, JR. ,  Kristen Nguyen Parrish

IPC: H01L23/64 ,  H01L49/02 ,  H01L23/31 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495

Abstract: An integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate. The coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the coil and the electronic component.

公开(公告)号：US11456262B2

公开(公告)日：2022-09-27

申请号：US17138150

申请日：2020-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuki Sato ,  Kenji Otake ,  Takafumi Ando ,  Jeffrey Morroni ,  Charles Allen Devries, Jr. ,  Kristen Nguyen Parrish

IPC: H01L23/64 ,  H01L49/02 ,  H01L23/31 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495

Abstract: An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate and the substrate-based coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the substrate-based coil and the electronic component.

公开(公告)号：US10396016B2

公开(公告)日：2019-08-27

申请号：US15395429

申请日：2016-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Joyce Marie Mullenix ,  Roberto Giampiero Massolini ,  Kristen Nguyen Parrish ,  Osvalod Jorge Lopez ,  Jonathan Almeria Noquil

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/552 ,  H01L23/64

Abstract: One example includes a device that is comprised of a die, a leadframe, and an electrically conductive material. The die includes a circuit therein. The leadframe is coupled with the die and the circuit therein. The electrically conductive material is disposed in a space above the die opposite the leadframe, the electrically conductive material being coupled to the leadframe and configured as one or more turns thereof to form at least one inductor.

公开(公告)号：US11348808B2

公开(公告)日：2022-05-31

申请号：US16818849

申请日：2020-03-13

Applicant: Texas Instruments Incorporated

Inventor： Kristen Nguyen Parrish ,  Charles Devries

IPC: H01L21/56 ,  H01L23/495 ,  H01L21/48 ,  H01F27/28 ,  H02M3/155 ,  H02M1/08 ,  H01F27/24 ,  H01L21/78 ,  H01F27/30 ,  H01F17/04 ,  H01F27/40

Abstract: A method for manufacturing a switch-mode converter includes forming a plurality of windings by coiling one or more conductors. Each of the windings is secured to one of a plurality of module bases arranged in a module array. At least one side of the array is encapsulated in a magnetic mold compound.

公开(公告)号：US20210343662A1

公开(公告)日：2021-11-04

申请号：US17138150

申请日：2020-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuki Sato ,  Kenji Otake ,  Takafumi Ando ,  Jeffrey Morroni ,  Charles Allen Devries, JR. ,  Kristen Nguyen Parrish

IPC: H01L23/64 ,  H01L49/02 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate and the substrate-based coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the substrate-based coil and the electronic component.

公开(公告)号：US20200313555A1

公开(公告)日：2020-10-01

申请号：US16364492

申请日：2019-03-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Charles Allen DeVries, JR. ,  Kyle Brent Norell ,  Kristen Nguyen Parrish

IPC: H02M3/158 ,  H01F27/28 ,  H01F41/04

Abstract: A device includes a circuit assembly and a first conductive winding support having a first end attached to the circuit assembly and having a first winding support surface a first distance from the circuit assembly. The device also includes a second conductive winding support having a second end attached to the circuit assembly and having a second winding support surface a second distance from the circuit assembly, the second distance being different than the first distance. A conductive winding has first and second winding ends. The first winding end is attached to the first winding support surface, and the second winding end is attached to the second winding support surface.