Invention Grant
- Patent Title: Low loss high-speed interconnects
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Application No.: US17030634Application Date: 2020-09-24
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Publication No.: US11456516B2Publication Date: 2022-09-27
- Inventor: Ling Li Ong , Kin Wai Lee , Bok Eng Cheah , Yang Liang Poh , Yean Ling Soon
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Priority: MYPI2019007400 20191211
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H01L23/552 ; H01L23/528 ; H01L23/66

Abstract:
An electronic device and associated methods are disclosed. In one example, the electronic device can include an assembly having asymmetrically situated conductors. In selected examples, the assembly includes a ground plane, a central shield portion, a first side shield portion on a first side, a second side shield portion on a second side, a first conductor asymmetrically situated between the central shield portion and the first side shield portion, a second conductor asymmetrically situated between the central shield portion and the second side shield portion, and dielectric within the assembly.
Public/Granted literature
- US20210184326A1 LOW LOSS HIGH-SPEED INTERCONNECTS Public/Granted day:2021-06-17
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