公开(公告)号：US20210184326A1

公开(公告)日：2021-06-17

申请号：US17030634

申请日：2020-09-24

Applicant: Intel Corporation

Inventor： Ling Li Ong ,  Kin Wai Lee ,  Bok Eng Cheah ,  Yang Liang Poh ,  Yean Ling Soon

IPC: H01P3/08 ,  H01L23/66 ,  H01L23/528 ,  H01L23/552

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device can include an assembly having asymmetrically situated conductors. In selected examples, the assembly includes a ground plane, a central shield portion, a first side shield portion on a. first side, a second side shield portion on a second side, a first conductor asymmetrically situated between the central shield portion and the first side shield portion, a second conductor asymmetrically situated between the central shield portion and the second side shield portion, and dielectric within the assembly.

公开(公告)号：US11456516B2

公开(公告)日：2022-09-27

申请号：US17030634

申请日：2020-09-24

Applicant: Intel Corporation

Inventor： Ling Li Ong ,  Kin Wai Lee ,  Bok Eng Cheah ,  Yang Liang Poh ,  Yean Ling Soon

IPC: H01P3/08 ,  H01L23/552 ,  H01L23/528 ,  H01L23/66

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device can include an assembly having asymmetrically situated conductors. In selected examples, the assembly includes a ground plane, a central shield portion, a first side shield portion on a first side, a second side shield portion on a second side, a first conductor asymmetrically situated between the central shield portion and the first side shield portion, a second conductor asymmetrically situated between the central shield portion and the second side shield portion, and dielectric within the assembly.