Invention Grant
- Patent Title: Pattern-forming method and patterned substrate
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Application No.: US16597947Application Date: 2019-10-10
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Publication No.: US11462405B2Publication Date: 2022-10-04
- Inventor: Hiroyuki Komatsu , Miki Tamada , Hitoshi Osaki , Tomoki Nagai
- Applicant: JSR CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JSR CORPORATION
- Current Assignee: JSR CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2018-192142 20181010,JPJP2019-184776 20191007
- Main IPC: G03F7/075
- IPC: G03F7/075 ; H01L21/033 ; B81C1/00 ; G03F7/26 ; H01L21/308

Abstract:
A pattern-forming method includes forming a prepattern and including a first polymer is formed on a silicon-containing film on a substrate. An underlayer film including a second polymer is formed in recessed portions of the prepattern. A composition for directed self-assembled film formation including a third polymer is applied on the underlayer film and the prepattern. The first polymer includes a first structural unit. The second polymer includes: a molecular chain including the first structural unit and a second structural unit that differs from the first structural unit; and an end structure that bonds to one end of the molecular chain and includes at least one selected from the group consisting of an amino group, a hydroxy group and a carboxy group. The third polymer is a block copolymer including a block of the first structural unit and a block of the second structural unit.
Information query
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