Invention Grant
- Patent Title: Substrate cores for warpage control
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Application No.: US17090926Application Date: 2020-11-06
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Publication No.: US11462488B2Publication Date: 2022-10-04
- Inventor: Seok Ling Lim , Bok Eng Cheah , Jackson Chung Peng Kong , Jenny Shio Yin Ong
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Viering, Jentschura & Partner MBB
- Priority: MYPI2020004578 20200903
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/14 ; H01L21/48 ; H01L23/498 ; H01L23/16

Abstract:
According to the various aspects, a package substrate with a heterogeneous substrate core including a first core layer that is coextensive with the package substrate and extends through a first section and a second section of the substrate core, in which the first section is adjacent to and thicker than the second section. The first section having at least a second layer and/or a third layer to provide the difference in thickness with the second section.
Public/Granted literature
- US20220068843A1 SUBSTRATE CORES FOR WARPAGE CONTROL Public/Granted day:2022-03-03
Information query
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