- 专利标题: Form board preparation for wire bundling
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申请号: US16666274申请日: 2019-10-28
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公开(公告)号: US11489309B2公开(公告)日: 2022-11-01
- 发明人: Damien O. Martin , Lars E. Blacken , Bradley J. Mitchell , Grace L. Duncan , Eerik J. Helmick , Keith M. Cutler , Randall V. Fraker , Alexey S. Meerov , John R. Porter
- 申请人: The Boeing Company
- 申请人地址: US IL Chicago
- 专利权人: The Boeing Company
- 当前专利权人: The Boeing Company
- 当前专利权人地址: US IL Chicago
- 代理机构: Ostrager Chong Flaherty & Broitman P.C.
- 主分类号: B23P19/00
- IPC分类号: B23P19/00 ; H01R43/28 ; H02G1/14 ; H01B13/012 ; H01R43/20 ; F16B19/10 ; G06F30/15 ; G06F30/18 ; G06F113/16
摘要:
Systems and methods for designing and assembling form boards with attached wire routing devices for use in wire bundle assembly. The assembly method comprises: (a) establishing a coordinate system of a form board having a multiplicity of holes; (b) using a computer system to determine locations of form board devices of different types with reference to the coordinate system of the form board based on engineering data specifying a wire bundle configuration; and (c) fastening the form board devices of different types to respective holes of the form board having centers closest to respective locations determined in step (b). The form board devices may be inserted robotically or manually.
公开/授权文献
- US20210126418A1 Form Board Preparation for Wire Bundling 公开/授权日:2021-04-29
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