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公开(公告)号:US11489309B2
公开(公告)日:2022-11-01
申请号:US16666274
申请日:2019-10-28
申请人: The Boeing Company
发明人: Damien O. Martin , Lars E. Blacken , Bradley J. Mitchell , Grace L. Duncan , Eerik J. Helmick , Keith M. Cutler , Randall V. Fraker , Alexey S. Meerov , John R. Porter
IPC分类号: B23P19/00 , H01R43/28 , H02G1/14 , H01B13/012 , H01R43/20 , F16B19/10 , G06F30/15 , G06F30/18 , G06F113/16
摘要: Systems and methods for designing and assembling form boards with attached wire routing devices for use in wire bundle assembly. The assembly method comprises: (a) establishing a coordinate system of a form board having a multiplicity of holes; (b) using a computer system to determine locations of form board devices of different types with reference to the coordinate system of the form board based on engineering data specifying a wire bundle configuration; and (c) fastening the form board devices of different types to respective holes of the form board having centers closest to respective locations determined in step (b). The form board devices may be inserted robotically or manually.
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公开(公告)号:US20210126418A1
公开(公告)日:2021-04-29
申请号:US16666274
申请日:2019-10-28
申请人: The Boeing Company
发明人: Damien O. Martin , Lars E. Blacken , Bradley J. Mitchell , Grace L. Duncan , Eerik J. Helmick , Keith M. Cutler , Randall V. Fraker , Alexey S. Meerov , John R. Porter
摘要: Systems and methods for designing and assembling form boards with attached wire routing devices for use in wire bundle assembly. The assembly method comprises: (a) establishing a coordinate system of a form board having a multiplicity of holes; (b) using a computer system to determine locations of form board devices of different types with reference to the coordinate system of the form board based on engineering data specifying a wire bundle configuration; and (c) fastening the form board devices of different types to respective holes of the form board having centers closest to respective locations determined in step (b). The form board devices may be inserted robotically or manually.
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