Invention Grant
- Patent Title: Apparatus and method for processing substrate
-
Application No.: US17026389Application Date: 2020-09-21
-
Publication No.: US11495474B2Publication Date: 2022-11-08
- Inventor: Yong Hee Lee , Young Hun Lee , Jinwoo Jung , Eui Sang Lim
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-do
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: KR10-2017-0162567 20171130,KR10-2018-0031000 20180316
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/67 ; H01L21/687

Abstract:
Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.
Public/Granted literature
- US20210005470A1 APPARATUS AND METHOD FOR PROCESSING SUBSTRATE Public/Granted day:2021-01-07
Information query
IPC分类: