公开(公告)号：US11908710B2

公开(公告)日：2024-02-20

申请号：US17520826

申请日：2021-11-08

申请人： SEMES CO., LTD.

发明人： Jin Woo Jung ,  Do Hyeon Yoon ,  Yong Hee Lee

IPC分类号： H01L21/67 ,  H01L21/02 ,  H01L21/677

CPC分类号： H01L21/67028 ,  H01L21/02101 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/67739

摘要： A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.

公开(公告)号：US11495474B2

公开(公告)日：2022-11-08

申请号：US17026389

申请日：2020-09-21

申请人： SEMES CO., LTD.

发明人： Yong Hee Lee ,  Young Hun Lee ,  Jinwoo Jung ,  Eui Sang Lim

IPC分类号： H01L21/02 ,  H01L21/67 ,  H01L21/687

摘要： Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.

公开(公告)号：US11942337B2

公开(公告)日：2024-03-26

申请号：US17063820

申请日：2020-10-06

申请人： SEMES CO., LTD.

发明人： Eui Sang Lim ,  Young Hun Lee ,  Jinwoo Jung ,  Miso Park ,  Byongwook Ahn ,  Yong Hee Lee

IPC分类号： H01L21/67 ,  H01J37/32

CPC分类号： H01L21/67017 ,  H01J37/32449 ,  H01J37/32467 ,  H01J37/32715 ,  H01J37/32834 ,  H01J2237/334

摘要： The apparatus includes a support unit to support the substrate in a treatment space of a process chamber, a first fluid supply unit to supply a supercritical fluid having an organic solvent dissolved in the supercritical fluid, to the treatment space, a second fluid supply unit to supply the supercritical fluid having no organic solvent dissolved in the supercritical fluid, to the treatment space, an exhaust unit to exhaust the treatment space, a controller to control the first fluid supply unit, the second fluid supply unit, and the exhaust unit. The controller controls the first and second fluid supply units such that the supercritical fluid having no organic solvent dissolved in the supercritical fluid is supplied to the treatment space through the second fluid supply unit, after the supercritical fluid mixed with the organic solvent is supplied to the treatment space through the first fluid supply unit.

公开(公告)号：US09406501B2

公开(公告)日：2016-08-02

申请号：US13905634

申请日：2013-05-30

申请人： Semes Co., Ltd.

发明人： Yong Hee Lee ,  Bok Kyu Lee ,  Jongsu Choi

IPC分类号： B08B3/00 ,  H01L21/02 ,  H01L21/67

CPC分类号： H01L21/02041 ,  H01L21/02052 ,  H01L21/67051

摘要： Provided are an apparatus and a method of cleaning a substrate. The apparatus includes a substrate supporting unit supporting a substrate, a container surrounding the substrate supporting unit and collecting an organic solvent scattered from the substrate, and a fluid supplying unit provided on one side of the container and spraying a liquid organic solvent with bubbles to the substrate. The fluid supplying unit includes a nozzle head ejecting the organic solvent to the substrate, an organic solvent supplying line supplying the organic solvent from an organic solvent storage tank to the nozzle head, and a bubble providing element provided on the organic solvent supplying line and providing bubbles to the liquid organic solvent.

摘要翻译： 提供一种清洗基板的装置和方法。 该装置包括支撑基板的基板支撑单元，围绕基板支撑单元并收集从基板散射的有机溶剂的容器以及设置在容器的一侧上的流体供给单元，并且向液体有机溶剂喷射气泡 基质。 流体供给单元包括将有机溶剂喷射到基板的喷嘴头，将有机溶剂从有机溶剂容器供给到喷嘴头的有机溶剂供给管线和设置在有机溶剂供给管线上的气泡供给元件， 气泡到液体有机溶剂。

公开(公告)号：US10395915B2

公开(公告)日：2019-08-27

申请号：US14190534

申请日：2014-02-26

申请人： Semes Co., Ltd.

发明人： Se Won Lee ,  Yong Hee Lee ,  Jae Yong Kim

IPC分类号： H01L21/02 ,  H01L21/67

摘要： Provided is a substrate treatment apparatus. The apparatus includes a chuck supporting a substrate and being rotatable, a container surrounding the chuck and collecting chemicals scattered due to rotations of the substrate, and a first spray nozzle spraying the chemicals to the substrate.

公开(公告)号：US10818519B2

公开(公告)日：2020-10-27

申请号：US16044601

申请日：2018-07-25

申请人： SEMES CO., LTD.

发明人： Yong Hee Lee ,  Young Hun Lee

IPC分类号： H01L21/67 ,  H01L21/687 ,  H01L21/02

摘要： Disclosed are an apparatus and a method for drying a substrate. The apparatus for drying a substrate includes a chamber having a treatment space in the interior thereof, a substrate support unit configured to the substrate in the treatment space, a conversion unit configured to convert a state of the substrate supported by the substrate support unit between a horizontal state and an inclined state, a fluid supply unit configured to supply a drying fluid into the treatment space, and a controller configured to control the conversion unit and the fluid supply unit.

公开(公告)号：US12014938B2

公开(公告)日：2024-06-18

申请号：US17955206

申请日：2022-09-28

申请人： SEMES CO., LTD.

发明人： Yong Hee Lee ,  Young Hun Lee ,  Jinwoo Jung ,  Eui Sang Lim

IPC分类号： H01L21/67 ,  H01L21/02 ,  H01L21/687

CPC分类号： H01L21/67051 ,  H01L21/02057 ,  H01L21/02101 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/6715 ,  H01L21/68707 ,  H01L21/68764 ,  H01L21/6719

摘要： Disclosed is a method for processing a substrate, comprising a liquid processing step of performing liquid processing on the substrate by supplying a processing liquid onto the substrate in a liquid processing chamber, a transfer step of transferring the substrate from the liquid processing chamber to a drying chamber, and a drying step of drying the substrate in the drying chamber. In the drying step, the substrate is dried while an edge region of the substrate other than a central region of the substrate is supported by a support unit, and in the liquid processing step, the liquid processing is performed on the substrate such that a height of the processing liquid remaining on the edge region of the substrate is greater than a height of the processing liquid remaining on the central region of the substrate when the liquid processing is completed in the liquid processing chamber.

公开(公告)号：US11842903B2

公开(公告)日：2023-12-12

申请号：US17061622

申请日：2020-10-02

申请人： Semes Co., Ltd

发明人： Miso Park ,  Yong Hee Lee

IPC分类号： H01L21/67 ,  B08B7/00

CPC分类号： H01L21/67051 ,  B08B7/0021

摘要： An apparatus for treating a substrate is provided. The apparatus for treating the substrate includes a high pressure chamber to provide a treatment space to perform a process of treating the substrate using a process fluid, a fluid supply source to provide the process fluid to the high pressure chamber, a fluid supply unit to supply the process fluid to the treatment space of the high pressure chamber, an exhaust unit to exhaust the process fluid in the high pressure chamber, and a pre-vent unit to vent a process fluid remaining inside a supply line.

公开(公告)号：US20140060575A1

公开(公告)日：2014-03-06

申请号：US14012523

申请日：2013-08-28

申请人： SEMES CO. LTD

发明人： Kang Suk Lee ,  Jae Myoung Lee ,  Bok Kyu Lee ,  Yong Hee Lee ,  Jin Bok Lee

IPC分类号： H01L21/02

CPC分类号： H01L21/02057 ,  H01L21/67028 ,  H01L21/6715

摘要： Provided is a substrate treating method. The substrate treating method may include treating a substrate by using a chemical solution; rinsing the substrate by using pure water after treating the substrate by using the chemical solution; and treating the substrate by using an organic solvent, wherein the substrate treating method further includes coating the substrate with a hydrophobic membrane between the treating of the chemical solution and the treating of the organic solvent.

摘要翻译： 提供了一种基板处理方法。 基板处理方法可以包括使用化学溶液处理基板; 通过使用化学溶液处理基材后，使用纯水冲洗基材; 以及使用有机溶剂处理所述基材，其中所述基材处理方法还包括在所述化学溶液的处理和所述有机溶剂的处理之间用疏水膜涂覆所述基材。